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Epec's Blog | Electronics Manufacturing Solutions


What Causes Circuit Board Blow Hole Defects?

Written by Chris Perry
Posted on July 3, 2014 at 2:19 PM

When a blow hole defect occurs during the assembly process as a result of the PCB card, the primary culprit tends to be entrapped moisture or air. With moisture, any non-plated and non-masked areas on a bare circuit board that expose internal laminate can be suspect to absorbing moisture. Absorption can occur either during the board fabrication process or from improper storage. Examples of highly suspect areas include non-plated drilled holes and routed features.

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Why Bake OSP Circuit Boards Before Use?

Written by Chris Perry
Posted on April 29, 2014 at 1:47 PM

It is not recommended to bake boards with an organic solderability preserve (OSP) surface finish. Although baking a printed circuit board with an organic solderability preserve finish can have negative consequences, the process itself can have positive performance in specific applications. OSP is a very thin protective layer of material placed over exposed copper, typically using a conveyorized process to protect the copper from tarnish.

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What Causes Pad Lifting On Printed Circuit Boards?

Written by Chris Perry
Posted on November 8, 2013 at 2:19 PM

Generally pads are small round or square areas of copper which are normally used to make a connection to a component pin. If these pads are not sitting correctly or are lifted, it can cause the connection between the printed circuit board (PCB) and the component to fail.

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Selecting the Most Capable Supplier: Quality Management

Written by Ed McMahon
Posted on May 20, 2013 at 1:29 PM

[This post is a continuation of Selecting the Most Capable Supplier: Part 1]

In the second part of this post, we will discuss 3 specific processes that you should review to control for manufacturing supplier quality management before starting to do business with them. As a customer, you need to know that every aspect of your order is managed with the utmost care in a process that is repeatable and accountable.

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Proper Handling of ENIG and Immersion PCB Surface Finishes

Written by Chris Perry
Posted on March 21, 2013 at 10:35 AM

Printed circuit boards (PCBs) with immersion finishes such as electroless nickel immersion gold (ENIG), immersion tin, silver, and OSP are appealing because they are lead-free. However, if handled improperly, these materials are susceptible to oxidation and corrosion from exposure to moisture and humidity. This oxidation causes dewetting after soldering, which can lead to poor joints at assembly and ultimately lead to failure of the board.

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