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Epec's Blog | Electronics Manufacturing Solutions


ENEPIG Benefits for Gold Wire Bonding

Written by Chris Perry
Posted on November 27, 2018 at 9:15 AM

ENEPIG (Electroless Nickel, Immersion Palladium, Immersion Gold) was derived out of the need to combat the challenge with the immersion gold process and Black Pad Syndrome. Black Pad (the hyper corrosion of underlying nickel) was baffling both PCB assemblers and manufacturers. After much analysis, the root cause was determined to be the nickel deposit.

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Printed Circuit Board Solderability Issues

Written by Chris Perry
Posted on August 14, 2018 at 10:29 AM

Solving solderability issues for printed circuit boards (PCBs) can be a real hassle. Nothing is more frustrating than having lined up all your materials for an assembly, only to start running the package through reflow and discover that the solder paste is wetting poorly to the pads. Immediately, the profile is checked to confirm proper parameters.

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What are Non-Conformances and How do PCB Manufacturers Fix Them?

Written by Chris Perry
Posted on August 3, 2018 at 12:37 PM

For customers and suppliers along the PCB manufacturing process, non-conformances will, unfortunately, happen from time to time. A non-conformance consists of receiving an order for printed circuit boards that do not meet your specifications or industry (IPC) standards. While dealing with these issues is obviously essential, the solution is sometimes not obvious and can put on-time delivery to your customer at risk. It is imperative that your circuit board supplier can deliver conforming product as soon as possible, which means having the procedures to get there.

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Why Is A Supplier Quality Manual Still Needed?

Written by Chris Perry
Posted on June 26, 2018 at 9:02 AM

With the introduction of ISO 9001:2015, which specifies requirements for quality management systems, the statement “quality management system documentation shall include a quality manual” no longer need apply. Many celebrated this as a reprieve from previously having to fully document their quality management system. However, eliminating the supplier quality manual altogether could be a dangerous takeaway on the new standard’s intention.

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5 Whys Root Cause Analysis Starts with a Problem Statement

Written by Epec Engineered Technologies
Posted on April 24, 2018 at 9:22 AM

Root cause analysis is a technique performed to identify the underlying reasons why a particular problem is occurring. At Epec, we do a lot of problem solving. As manufacturers, we strive to discover better, more efficient ways to delight our customers. Whether we are working on an 8D CAPA or running an A3 Project, we are often working to determine the foundational cause of issues as the means to solving the problem.

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Urban Legends of PCB Processes: ENIG Black Pad

Written by Chris Perry
Posted on January 19, 2018 at 2:37 PM

I can remember the first ‘incident’ of black pad, years ago, when Epec started to use the electroless nickel immersion gold (ENIG) process. We didn’t notice the issue at the time, as it is not evident on the bare board, but received the complaint from assembly as it was later identified on completed assemblies.

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Stop Sending Supplier Surveys

Written by Epec Engineered Technologies
Posted on August 16, 2017 at 3:50 PM

Within industries like electronics manufacturing, suppler self-surveys are very popular. At any given moment here at Epec, we are processing five or so supplier surveys. We send them out ourselves. I have dealt with supplier surveys, one way or another, for the last twenty something years. But, what purpose do they serve, and more importantly, what value do they provide to your organization?

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RMA Process and Root Cause Analysis in Manufacturing

Written by Epec Engineered Technologies
Posted on May 11, 2017 at 12:34 PM

We find that return merchandise authorizations (RMAs) are a powerful statement of a customer’s level of dissatisfaction. RMAs can offer evidence if a manufacturing process fell short of its goal, there was a lack of communication throughout processes, or even misdiagnosed a problem. In any case, we stand behind our product and are ready to support our customer.

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Importance of an ISO Certification For Manufacturers

Written by Ed McMahon
Posted on February 23, 2017 at 9:46 AM

In 1999 there were over 1,200 active printed circuit board (PCB) manufacturing facilities in the U.S. Today, there are fewer than 130. What has transpired at a lot of these manufacturing companies are small service businesses that act as a liaison between a manufacturer and their customers. In many instances, this is a valuable relationship; the products are low in technology and the risk is very minimal. However, why is it that we require ISO certification for our manufacturing locations but not for service providers?

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Understanding An IPC 4101 Slash Sheet

Written by Chris Perry
Posted on January 31, 2017 at 11:53 AM

IPC 4101 (Specification for Base Materials for Rigid and Multi-Layer Printed Circuit Boards) was released for publication in December, 1997. It was released as the replacement standard for MIL-S-13949. However, it contained a majority of the exact wording from the military standard. It maintained the “slash sheet” format appendix to the standard that specifies the resin and fiber system of different PCB laminates, along with testing parameters and properties. Initially there were 41 slash sheets, but as the industry opens up to “Lead Free” and “Green” processes, the slash sheets have increased to 66, the current revision.

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