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Blog | Manufacturing Solutions


User Interface Functional Test Schemes

Written by Epec Engineered Technologies
Posted on February 13, 2015 at 11:17 AM

This blog post addresses custom user interface testing in terms of functional test schemes that are completed prior to shipment. Generally, the first user interface assemblies shipment are for First Article acceptance testing where customers fully examine the first units for mechanical and electrical compliance to all engineering drawing and specifications.

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V Score of Printed Circuit Boards in Arrays

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on January 14, 2015 at 3:17 PM

When designing PCBs in a multi-up array, most designers choose v-score (also referred to as v score, v cut, or v groove) as the singulation method over traditional rout and breakaway tabs. The benefits of v-scoring pcb range from effortless removal of parts from panel form to realized cost savings with better utilization of panel area. When designing a circuit boards in array with v-scoring, there are two areas of concern - the angle of the cut, and the depth of the cut.

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The Use of Strain Relief with Rigid-Flex Printed Circuit Boards

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on November 12, 2014 at 10:13 AM

For rigid-flex printed circuit boards (PCBs), the space joining rigid material to flex material (Transition Zone) sometimes contains imperfections that, although acceptable, could impact effectiveness of the final part. Transition zone imperfections can include any of the following:

  • Adhesive squeeze-out
  • Protruding dielectric materials
  • Crazing
  • Haloing
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What Causes Circuit Board Blow Hole Defects?

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on July 3, 2014 at 2:19 PM

When a blow hole defect occurs during the assembly process as a result of the PCB card, the primary culprit tends to be entrapped moisture or air. With moisture, any non-plated and non-masked areas on a bare circuit board that expose internal laminate can be suspect to absorbing moisture. Absorption can occur both during board fabrication and during improper storage. Examples of highly suspect areas include non-plated drilled holes and routed features.

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Why Bake OSP Circuit Boards Before Use?

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on April 29, 2014 at 1:47 PM

It is not recommended to bake boards with an Organic Solderability Preserve (OSP) finish. Although baking a printed circuit board with an organic solderability preserve finish can have negative consequences, the process itself can have positive performance in specific applications. OSP is a very thin protective layer of material placed over exposed copper, typically using a conveyorized process to protect the copper from tarnish.

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What Causes Pad Lifting On Printed Circuit Boards?

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on November 8, 2013 at 2:19 PM

Generally pads are small round or square areas of copper which are normally used to make a connection to a component pin. If these pads are not sitting correctly or are lifted, it can cause the connection between the printed circuit board (PCB) and the component to fail.

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Proper Handling of Immersion PCB Surface Finishes

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on March 21, 2013 at 10:35 AM

Printed circuit boards (PCBs) with immersion finishes such as electroless nickel immersion gold (ENIG), immersion tin, silver, and OSP are appealing because they are lead-free. However, when handled improperly, these materials are susceptible to oxidation and corrosion from exposure to moisture and humidity. This oxidation causes dewetting after soldering, which can lead to poor joints at assembly and ultimately lead to failure of the board.

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