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Epec's Blog | Electronics Manufacturing Solutions

Chris Perry

Chris Perry
Chris has been with Epec for almost two decades, including 8 years manufacturing experience within a quality control role and 2 years in the front end planning department. As a lab technician, Chris analyzed and maintained chemical processes within bare board manufacturing, while aiding with overall quality in all departments. He also monitored and maintained the company wastewater facility to comply with local environmental agencies. As Epec has grown, Chris has continued to accept new responsibilities within the company. Chris has also held the role of PCB planning, where he learned the entire process, through customer delivery. Chris has been certified through Addstan Management Systems as an ISO 9001:2000 Internal Auditor, and most recently received IPC-A-600 Certified IPC Specialist from Eptac Corporation. Chris received his A.S. degree in Environmental Science at Bristol College, was certified as Class III Industrial Wastewater operator, and also was certified as an emergency response operator.

Recent Posts


Navigating Fracturing Challenges: Non-Plated Holes in PCB Engineering

Written by Chris Perry
Posted on February 16, 2024 at 8:46 AM

In the realm of printed circuit board (PCB) engineering, the design incorporates through holes as a means to establish connections across the board's various layers or secure the card during the assembly process. These through holes come in two distinct categories: plated and non-plated.

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Misinterpreting IPC-6012 Standards for Rigid Printed Circuit Boards

Written by Chris Perry
Posted on April 27, 2022 at 9:16 AM

The purpose of IPC specification is to provide requirements for qualification and performance of rigid printed circuit boards based on the following constructions and/or technologies. These requirements apply to the finished product unless otherwise specified.

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ENEPIG Benefits for Gold Wire Bonding

Written by Chris Perry
Posted on November 27, 2018 at 9:15 AM

ENEPIG (Electroless Nickel, Immersion Palladium, Immersion Gold) was derived out of the need to combat the challenge with the immersion gold process and Black Pad Syndrome. Black Pad (the hyper corrosion of underlying nickel) was baffling both PCB assemblers and manufacturers. After much analysis, the root cause was determined to be the nickel deposit.

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Printed Circuit Board Solderability Issues

Written by Chris Perry
Posted on August 14, 2018 at 10:29 AM

Solving solderability issues for printed circuit boards (PCBs) can be a real hassle. Nothing is more frustrating than having lined up all your materials for an assembly, only to start running the package through reflow and discover that the solder paste is wetting poorly to the pads. Immediately, the profile is checked to confirm proper parameters.

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What are Non-Conformances and How do PCB Manufacturers Fix Them?

Written by Chris Perry
Posted on August 3, 2018 at 12:37 PM

For customers and suppliers along the PCB manufacturing process, non-conformances will, unfortunately, happen from time to time. A non-conformance consists of receiving an order for printed circuit boards that do not meet your specifications or industry (IPC) standards. While dealing with these issues is obviously essential, the solution is sometimes not obvious and can put on-time delivery to your customer at risk. It is imperative that your circuit board supplier can deliver conforming product as soon as possible, which means having the procedures to get there.

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Why Is A Supplier Quality Manual Still Needed?

Written by Chris Perry
Posted on June 26, 2018 at 9:02 AM

With the introduction of ISO 9001:2015, which specifies requirements for quality management systems, the statement “quality management system documentation shall include a quality manual” no longer need apply. Many celebrated this as a reprieve from previously having to fully document their quality management system. However, eliminating the supplier quality manual altogether could be a dangerous takeaway on the new standard’s intention.

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Urban Legends of PCB Processes: ENIG Black Pad

Written by Chris Perry
Posted on January 19, 2018 at 2:37 PM

I can remember the first ‘incident’ of black pad, years ago, when Epec started to use the electroless nickel immersion gold (ENIG) process. We didn’t notice the issue at the time, as it is not evident on the bare board, but received the complaint from assembly as it was later identified on completed assemblies.

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The PCB Jump Scoring Process

Written by Chris Perry
Posted on October 12, 2017 at 3:36 PM

The V-score process is the addition of thin, double-sided cuts into printed circuit board (PCB) laminate for the purpose of assisting in the removal of individual parts from the array. The thin cuts which do not go all the way through the material, act as a perforation of the laminate so simple flexing of the laminate, or use of a cutting wheel, will aid in the removal of parts after the assembly process.

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Poor PCB Silkscreen Legibility Issues

Written by Chris Perry
Posted on July 27, 2017 at 9:00 AM

Among the multiple layers of a printed circuit board (PCB) lies the PCB silkscreen layer. The placement of the silkscreen markings, whether on the top or bottom layer, in conjunction with the features of the other layers, could affect the final legibility of the printed circuit board markings.

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Understanding An IPC 4101 Slash Sheet

Written by Chris Perry
Posted on January 31, 2017 at 11:53 AM

IPC 4101 (Specification for Base Materials for Rigid and Multi-Layer Printed Circuit Boards) was released for publication in December, 1997. It was released as the replacement standard for MIL-S-13949. However, it contained a majority of the exact wording from the military standard. It maintained the “slash sheet” format appendix to the standard that specifies the resin and fiber system of different PCB laminates, along with testing parameters and properties. Initially there were 41 slash sheets, but as the industry opens up to “Lead Free” and “Green” processes, the slash sheets have increased to 66, the current revision.

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