Over the past several years LED based products have become increasingly popular, and as a result, so too have metal core printed circuit boards. The automobile and lighting sectors have both embraced the technology, as have consumers, given an LED based light can be about 5x cheaper to run than a comparable incandescent unit. Even compact fluorescents have slightly higher operating costs and they cannot compete with the smallest LEDs when it comes to efficient use of space.
Selecting PCB core thickness becomes a problem when a printed circuit board (PCB) fabricator receives a request for quotation of a multilayer design and the material requirements are stated either incompletely or not at all. This sometimes occurs because the combination of PCB core materials used is not critical to performance; if the overall thickness requirement is met, the end user may not care about the thickness or type of each layer.
All customers have questions when it comes to PCB laminate materials, so we took some of the most common questions and put together a helpful FAQ to bring you answers and solutions faster.
As custom manufactured cable assemblies have grown in complexity, it has become far more common to see various electronics integrated directly into the finished design. The inclusion of electronics into a cable assembly design can consist of adding a switch, PCB, LED, or a multitude of other components. Once added, these components offer a much higher level of sophistication to the cable assembly while allowing the included electronics the ability to withstand a much more rugged working environment.
The flex PCB stackup documentation is an important component of the data set of a flexible printed circuit board design. It consists of a description of a flex or rigid-flex circuit board that defines in detail the specific material requirements and construction of the design.
Many electronics assemblies that utilize flexible printed circuit boards are sensitive to either absorbing or emitting electromagnetic interference (EMI). If EMI is left uncontrolled it can negatively impact the performance of the design and in extreme cases completely prevent it from functioning.
The reason printed circuit boards (PCBs) require a surface finish rather than being left as simply bare copper is because while copper is an excellent conductor, leaving it exposed will cause it to oxidize and deteriorate over time. The increased exposure will cause the PCB to fail much sooner than expected.
EMI (electromagnetic interference) and RFI (radio-frequency interference) are disturbances generated by external sources that impact a cable assembly by degrading the assembly's performance or completely preventing it from functioning. These disturbances can cause problems ranging from an increase in error rates of the signal being transmitted through the assembly to total loss of any electronically readable signal.
For many narrow to wide bandwidth band pass applications, pure band pass filters (also bandpass filters or BPF) are a good fit, - forming rejection bands below and above the passband in a single filter. Coupled line, combline, and interdigital are three pure band pass filter types. Pure filters can be the most efficient solutions for loss and physical footprint where the specs mandate their usage. For ultra-wideband applications, pure solutions may require too many poles making physical size too large and insertion loss too high for many systems.
When designing and manufacturing passive broadband high frequency cascaded LC filters (inductor and capacitor), a lot of undesirable component interactions can occur if not properly managed. The goal is to minimize the difference between an RF microwave filter design constructed with ideal components and one using commercial off-the-shelf (COTS) and custom manufactured components.