It is not often we build an electronic device without any sort of prototyping, but it can happen given the nature of the project and the deadlines being met. If a customer needs a Human-Machine Interface (HMI) to hit the floor in 2 months, the time to develop and build a prototype is strained as both the customer and design engineers will want to test it and provide feedback.
When talking about the world of technology, we often focus on the performance that circuitry and components provide to keep up with the fast-paced electronics we use in commercial businesses and our daily lives. We are achieving higher processor speeds and frequencies that become demanding on present printed circuit boards (PCBs). Yet, we also need to focus on the sizes of the applications that can have an impact on the PCB design.
When tackling any new project, it’s human nature to focus on the most difficult and uncertain tasks first, while leaving the perceived low-risk and simple activities for the end. When it comes to developing a new product, whether it be for a medical device, commercial widget, or even a mil-aero box build, the initial focus is on the major system elements.
Overmolded cables are used in countless applications across almost every industry. The reasons to use an overmolded cable design are numerous, but the primary reason is to protect the electrical contacts while offering strain relief.
At Epec, engineers are expected to find innovative solutions to problems and develop them quickly and accurately so that customers can get quality product delivered on time. In this blog post, I will discuss how the 80-20 rule can be used in conjunction with our classic engineering design process to reach solutions faster.
The design of a multi-layer PCB (printed circuit boards) can be very complicated. The fact that a design even needs to use more than two layers implies that the required number of circuits will not fit onto just a top and a bottom surface. Even in cases where the circuitry does fit onto two external layers with no problem, the PCB designer may decide to add power and ground planes internally in order to correct a performance shortcoming.
Owing to the prevalence of complex processors, USB devices, and antennas printed directly onto the board surface, more and more PCB designs now require impedance control and testing than ever before. In response to the increased demand, circuit board manufacturers have invested in sophisticated modeling software and testing units, so they are equipped to meet the requirements.
At Epec we work on such a varied and technical catalog of products, so our engineers must be comfortable leveraging every manufacturing technology available to them in order to create solutions in design and production. One of the most important technologies that we use is 3D printing.
From controlling condensation on electronics to keeping food warm, flexible heaters provide many advantages to commercial industries such as medical, electronics, aerospace, food and beverage, and refrigeration. Silicone and Kapton® heaters are the most common heaters used due to their flexibility, great thermal transfer, rapid warmup and varying temperature applications.
Manufacturers requiring localized heating for their applications turn to the advantages of flexible heaters that are mounted to components and equipment. These heaters can provide low level or high-level heat at varying temperatures to offer the appropriate thermal transfer based on the applications.