In my last blog post, I reviewed the 5 why problem-solving method. In this blog post, we will continue this discussion so if you have not seen Part 1, I suggest you read that post first and then come back here.
In my last blog post, Five Why Root Cause Analysis Starts with a Good Problem Statement, I recommended that problem-solving teams develop well-crafted problem statements. This blog post will discuss the best practices for the five why method of root cause analysis.
We're all aware of the far-ranging uses and necessity for cables within electronics. With their widespread use and cables' inherent sensitivity to electromagnetic energy, the shielding methodology of a cable can be even more important than the conductor and jacket specifications.
There remains a misconception that borders on a cultural stigma towards off-brand or knockoff items. Consider your favorite breakfast cereal at your local supermarket as you walk down an aisle lined with name brand cereals strewn with cartoon characters and slogans, you may notice a less expensive version of the same exact cereal a few shelves lower. These off-brand cereals likely taste the same, have identical ingredients, but cost about half as much. Admittedly, my children prefer the name brand cereals, but when replaced with an off-brand equivalent of Special Popcorn Cereal, if I don’t show them the box, they will never know the difference.
Most test engineers agree that if you were to make a list of the major causes of compliance failures for most of the electronic products we use in our daily lives, radiated emissions (RE) would, undoubtedly, be right at the top.
ENEPIG (Electroless Nickel, Immersion Palladium, Immersion Gold) was derived out of the need to combat the challenge with the immersion gold process and Black Pad Syndrome. Black Pad (the hyper corrosion of underlying nickel) was baffling both PCB assemblers and manufacturers. After much analysis, the root cause was determined to be the nickel deposit.
Heat shrink tubing, also known as heat shrink, is a shrinkable tube that shrinks radially when exposed to heat. Produced using a two-step process, heat shrink is available in a wide range of materials to suit almost any application. Heat shrink tubing has many useful applications, including to provide electrical insulation to wires, connections, joints, terminals, and splices, as well as bundling loose items such as wires and as a protective covering.
Solving solderability issues for printed circuit boards (PCBs) can be a real hassle. Nothing is more frustrating than having lined up all your materials for an assembly, only to start running the package through reflow and discover that the solder paste is wetting poorly to the pads. Immediately, the profile is checked to confirm proper parameters.
With the introduction of ISO 9001:2015, which specifies requirements for quality management systems, the statement “quality management system documentation shall include a quality manual” no longer need apply. Many celebrated this as a reprieve from previously having to fully document their quality management system. However, eliminating the supplier quality manual altogether could be a dangerous takeaway on the new standard’s intention.
Root cause analysis is a technique performed to identify the underlying reasons why a particular problem is occurring. At Epec, we do a lot of problem solving. As manufacturers, we strive to discover better, more efficient ways to delight our customers. Whether we are working on an 8D CAPA or running an A3 Project, we are often working to determine the foundational cause of issues as the means to solving the problem.