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Epec's Blog | Electronics Manufacturing Solutions

Custom Battery Packs: Testing and Quality Assurance Measures

Written by Anton Beck
Posted on May 7, 2024 at 8:43 AM

Quality and performance are key considerations during custom battery pack manufacturing. If these factors are overlooked, potential battery issues and low-performing packs may enter the market. They could cause malfunctions and damage to devices, or not offer enough power for devices to perform.

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Navigating Fracturing Challenges: Non-Plated Holes in PCB Engineering

Written by Chris Perry
Posted on February 16, 2024 at 8:46 AM

In the realm of printed circuit board (PCB) engineering, the design incorporates through holes as a means to establish connections across the board's various layers or secure the card during the assembly process. These through holes come in two distinct categories: plated and non-plated.

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Determining Root Cause Analysis for Defective Electronics Projects

Written by Justin Bickford
Posted on February 22, 2023 at 8:42 AM

When it comes to faulty electronics, root-cause analysis is your best friend. Root-cause analysis is a process that helps you identify and correct the causes of problems. You want to find out why something went wrong so you can prevent it from happening again.

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Misinterpreting IPC-6012 Standards for Rigid Printed Circuit Boards

Written by Chris Perry
Posted on April 27, 2022 at 9:16 AM

The purpose of IPC specification is to provide requirements for qualification and performance of rigid printed circuit boards based on the following constructions and/or technologies. These requirements apply to the finished product unless otherwise specified.

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Common PCB Quality Issues and What to Inspect For

Written by Angie Brown
Posted on June 14, 2021 at 10:10 AM

As our world continues to evolve to an online buying market for everything for our homes, schools, and offices, you may have noticed in some cases, the quality is not exactly what you thought you saw and bought online. We have all had that men’s XL shirt we bought for dad’s birthday arrive only to fit our 7-10-year-old, or the gift for Christmas arriving in January. Is it cost vs. quality, convenience vs. going out shopping, or is it the ongoing COVID-19 situation?

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Understanding How Solder and Coatings Impact PCB Shelf Life

Written by Sherry Clowers
Posted on May 18, 2021 at 10:13 AM

Printed circuit boards (PCBs) may go through extreme wear-and-tear based on environmental factors. They may be placed in applications where there will be fluctuating temperatures, extreme heat, extreme cold, high humidity, salt water, and excessive moisture.

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What Are RoHS and REACH and What Do They Mean?

Written by Epec Engineered Technologies
Posted on May 28, 2019 at 10:31 AM

Working in the manufacturing industry, you’ve probably noticed the letters RoHS or REACH on various documentation or even browsing our website. But, have you ever wondered what these letters stand for or what the certification that comes with them entails?

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Root Cause Analysis Through the Five Why Method – Part 2

Written by Epec Engineered Technologies
Posted on May 14, 2019 at 11:52 AM

In my last blog post, I reviewed the 5 why problem-solving method. In this blog post, we will continue this discussion so if you have not seen Part 1, I suggest you read that post first and then come back here.

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Root Cause Analysis Through the Five Why Method - Part 1

Written by Epec Engineered Technologies
Posted on April 10, 2019 at 10:42 AM

In my last blog post, Five Why Root Cause Analysis Starts with a Good Problem Statement, I recommended that problem-solving teams develop well-crafted problem statements. This blog post will discuss the best practices for the five why method of root cause analysis.

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ENEPIG Benefits for Gold Wire Bonding

Written by Chris Perry
Posted on November 27, 2018 at 9:15 AM

ENEPIG (Electroless Nickel, Immersion Palladium, Immersion Gold) was derived out of the need to combat the challenge with the immersion gold process and Black Pad Syndrome. Black Pad (the hyper corrosion of underlying nickel) was baffling both PCB assemblers and manufacturers. After much analysis, the root cause was determined to be the nickel deposit.

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