Epec's Blog | Electronics Manufacturing Solutions

Peak Season is a term that is thrown around the shipping industry and generally refers to one of 4 major shipping events during a calendar year: Lunar (Chinese) New Year, which ranges from January to February, Back-to-School, which ranges from June to August, “Peak Season”, the pre-holiday peak (from August to October), and Golden Week, the holiday that takes place from Oct. 1-7 and results in a complete manufacturing shut down.

As the 2023 U.S. holiday season rolls into full gear, it’s impossible not to also think about the 2024 Chinese New Year (CNY). Maybe it’s because the U.S. holidays are busy not only at work but personally as well, for many of us, and by the time we catch our breath, the CNY is already on top of us.

When it comes to faulty electronics, root-cause analysis is your best friend. Root-cause analysis is a process that helps you identify and correct the causes of problems. You want to find out why something went wrong so you can prevent it from happening again.

Here at Epec, we take cybersecurity extremely seriously, and it's essential to stay up to date on the latest safety measures. That means understanding how hackers and scammers operate so you can protect yourself from them. To do this, it helps to learn about topics like password security, malware protection, data encryption, and firewalls. Taking the time to research these topics now can save you lots of trouble down the road.

Around the world, battery pack manufacturers are dealing with supply chain issues. These issues are impacting lead times when they gain battery cell chemistry and battery management system materials.

As we sit on the cusp of another festive/holiday/peak/Chinese New Year (CNY) shipping season, it feels like once again there are going to be new and challenging variables that we are going to have to navigate to be successful.

Designing medical devices is no simple task. The stakes are higher for these devices compared to most other industries. Because of that, medical device engineers need to think carefully about which design elements should be prioritized.

Solid modeling is the process of constructing a 3D model through a series of additive and subtractive operations while always maintaining a calculable volume. Surface modeling is the process of constructing a 3D model through the process of defining each of the faces that are present in its geometry.

When the electronics world was preparing for the Chinese New Year (CNY) 2020, I don’t think any of us could have imagined what we would be planning for CNY 2021, and even fewer people would have predicted what we will be going to be up against in 2022.

The last 18 months have been some of the most challenging that many of us have had to deal with both personally and professionally. It has often felt like we were riding waves, coming closer to things getting a little more normal, only to have them change radically. Looking forward to the next 18 months, I don’t see those changes getting any easier for us or our industry.