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Epec's Blog | Electronics Manufacturing Solutions


PCB Layout Quote: A Guide to Required Items

Written by Al Wright
Posted on June 4, 2019 at 9:24 AM

It is sometimes necessary to have some, or all, of your PCB layout projects done by an outside source. If you’ve never done a layout before, or if you don’t have the tools or experience to take on more complex projects, it is often better to have a professional complete the work.

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What Are RoHS and REACH and What Do They Mean?

Written by Michael Concepcion
Posted on May 28, 2019 at 10:31 AM

Working in the manufacturing industry, you’ve probably noticed the letters RoHS or REACH on various documentation or even browsing our website. But, have you ever wondered what these letters stand for or what the certification that comes with them entails?

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Challenges When Using Flexible Silicone and Kapton® Heaters

Written by Chris Perry
Posted on May 22, 2019 at 8:36 AM

From controlling condensation on electronics to keeping food warm, flexible heaters provide many advantages to commercial industries such as medical, electronics, aerospace, food and beverage, and refrigeration. Silicone and Kapton® heaters are the most common heaters used due to their flexibility, great thermal transfer, rapid warmup and varying temperature applications.

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Root Cause Analysis Through the Five Why Method – Part 2

Written by Marc Leclair
Posted on May 14, 2019 at 11:52 AM

In my last blog post, I reviewed the 5 why problem-solving method. In this blog post, we will continue this discussion so if you have not seen Part 1, I suggest you read that post first and then come back here.

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Flexible Heater Elements: Differences and Advantages

Written by Chris Perry
Posted on May 8, 2019 at 9:56 AM

Manufacturers requiring localized heating for their applications turn to the advantages of flexible heaters that are mounted to components and equipment. These heaters can provide low level or high-level heat at varying temperatures to offer the appropriate thermal transfer based on the applications.

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Flexible Heater Types: Which to Use for Your Application?

Written by Chris Perry
Posted on May 2, 2019 at 10:03 AM

Whether used in the aerospace industry to de-ice equipment, or the food industry to bring ingredients up to a suitable temperature, flexible heaters provide the right amount of generated heat based on the application. These types of heaters can be attached to smooth, bulky and curved equipment in different sizes and functions.

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Various Stiffener Materials for Flexible Circuit Boards

Written by Paul Tome
Posted on April 23, 2019 at 12:42 PM

Flexible circuit boards are necessary in numerous applications where a design requires the circuit to be bent within the electrical equipment or electronic device. However, it is not desired to have the flexible circuit board bend adjacent to connectors, mounted components, solder joints, and hole patterns. In these instances, a stiffener needs to be designed in to add rigidity and stability so that the flex circuit performs reliably.

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Flexible Circuit Board Material Selection

Written by Paul Tome
Posted on April 15, 2019 at 9:54 AM

Selecting the optimum flex circuit board material is a key element to the success of a flexible circuit design. A wide variety of materials and configurations are available to address the needs of today’s design applications.

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Root Cause Analysis Through the Five Why Method - Part 1

Written by Marc Leclair
Posted on April 10, 2019 at 10:42 AM

In my last blog post, Five Why Root Cause Analysis Starts with a Good Problem Statement, I recommended that problem-solving teams develop well-crafted problem statements. This blog post will discuss the best practices for the five why method of root cause analysis.

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Design Comparison: Flex Circuit with Stiffeners vs. Rigid-Flex PCB

Written by Paul Tome
Posted on April 2, 2019 at 10:49 AM

When developing a flex PCB based design, one of the most common early decisions is whether a flex circuit with stiffener(s) will meet the design requirements or if a rigid-flex construction is necessary or more effective. While there is some overlap between the two methodologies, there are significant capability, performance, and cost differences that require review to ensure a successful design.

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