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Epec's Blog | Electronics Manufacturing Solutions


Flexible Heater Elements: Differences and Advantages

Written by Chris Perry
Posted on May 8, 2019 at 9:56 AM

Manufacturers requiring localized heating for their applications turn to the advantages of flexible heaters that are mounted to components and equipment. These heaters can provide low level or high-level heat at varying temperatures to offer the appropriate thermal transfer based on the applications.

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Flexible Heater Types: Which to Use for Your Application?

Written by Chris Perry
Posted on May 2, 2019 at 10:03 AM

Whether used in the aerospace industry to de-ice equipment, or the food industry to bring ingredients up to a suitable temperature, flexible heaters provide the right amount of generated heat based on the application. These types of heaters can be attached to smooth, bulky and curved equipment in different sizes and functions.

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Various Stiffener Materials for Flexible Circuit Boards

Written by Paul Tome
Posted on April 23, 2019 at 12:42 PM

Flexible circuit boards are necessary in numerous applications where a design requires the circuit to be bent within the electrical equipment or electronic device. However, it is not desired to have the flexible circuit board bend adjacent to connectors, mounted components, solder joints, and hole patterns. In these instances, a stiffener needs to be designed in to add rigidity and stability so that the flex circuit performs reliably.

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Flexible Circuit Board Material Selection

Written by Paul Tome
Posted on April 15, 2019 at 9:54 AM

Selecting the optimum flex circuit board material is a key element to the success of a flexible circuit design. A wide variety of materials and configurations are available to address the needs of today’s design applications.

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Root Cause Analysis Through the Five Why Method - Part 1

Written by Marc Leclair
Posted on April 10, 2019 at 10:42 AM

In my last blog post, Five Why Root Cause Analysis Starts with a Good Problem Statement, I recommended that problem-solving teams develop well-crafted problem statements. This blog post will discuss the best practices for the five why method of root cause analysis.

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Design Comparison: Flex Circuit with Stiffeners vs. Rigid-Flex PCB

Written by Paul Tome
Posted on April 2, 2019 at 10:49 AM

When developing a flex PCB based design, one of the most common early decisions is whether a flex circuit with stiffener(s) will meet the design requirements or if a rigid-flex construction is necessary or more effective. While there is some overlap between the two methodologies, there are significant capability, performance, and cost differences that require review to ensure a successful design.

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Integrating Flex with Rigid PCB to Improve Design

Written by Paul Tome
Posted on March 27, 2019 at 9:49 AM

The integration of a flex circuit(s) with rigid PCBs into a rigid-flex configuration can solve many of today’s design challenges. The combination of the mechanical capabilities of flex circuits with the functionality of rigid PCBs is a solution that provides many benefits, including improved reliability, tighter packaging capabilities, high speed signal performance, reduced assembly costs, and opportunities for further overall design packaging reductions.

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Understanding the Actuation Force of Your Keypad

Written by Steven J Goodman
Posted on March 19, 2019 at 12:03 PM

Keypads that utilize dome switches, silicone elastomer keys, or tactile switches rely on actuation force as a critical feature to define how much load is required to close the normally open switch. In this context, force is a vector acting normal to the keypad surface and is usually defined in grams (g) or pound force (lbf).

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How to Specify Stiffener Requirements in Flex PCB Design Drawings

Written by Paul Tome
Posted on March 14, 2019 at 1:39 PM

Stiffeners are a key design element in most flex designs and have a significant impact on both the performance and reliability of the finished flex circuits. As a result, stiffeners need to be fully and accurately defined in the data set. Not doing so may result in a finished part that does not meet your requirements.

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Differences of Via in Pad Technology in Flex Circuits vs Rigid PCBs

Written by Paul Tome
Posted on March 5, 2019 at 10:52 AM

Many of today’s rigid-flex circuit designs utilize the same high-density components found in rigid PCB designs. This requires the use of blind and or buried vias to allow the signal lines to be routed out from within the high-density components or the high-density areas of the design. The most common component that we see driving this today is the 0.4mm pitch BGA package.

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