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Epec's Blog | Electronics Manufacturing Solutions


Best Practices for Graphic Overlay Color Selection

Written by Steven J Goodman
Posted on February 5, 2025 at 9:09 AM

In manufacturing, color is more than just a visual aesthetic. It is a critical factor influencing brand identity, product usability, and customer satisfaction. From the vibrant hues of a graphic overlay to the subtle tones of a silicone rubber keypad, manufacturers must navigate a complex world of color callouts to ensure their products meet functional and aesthetic requirements.

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Temperature Management and Safety Protocols for Flexible Heaters

Written by Miguel Sahagun
Posted on January 30, 2025 at 8:58 AM

When it comes to temperature regulation, look no further than your kitchen. Your coffee maker controls the temperature to ensure the water is heated for optimal brewing. Did you grab a water bottle on the way out of the door this morning? When you open the fridge, you expect your water to be cold. And, thanks to temperature management, it was.

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How to Select Material Used in Rigid-Flex PCB Manufacturing

Written by Zachary Walker
Posted on January 22, 2025 at 8:47 AM

When it comes to printed circuit boards, rigid-flex PCBs can be one of the most complicated. Many describe rigid-flex as being more akin to two boards in one, both in processes and materials. This can make for a difficult time in designing the board, setting standards, and even selecting materials.

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The Economics of Custom Battery Packs: Cost vs. Performance

Written by Anton Beck
Posted on January 16, 2025 at 9:06 AM

Extensive research and development in the battery manufacturing industry has pushed out vast innovations in the custom battery pack segment. The need for these battery packs has grown exponentially due to higher-performance products, utility companies utilizing storage devices, and the expansion of electric and hybrid vehicle markets.

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PCB Trace Width and Spacing: Calculations and Real-World Applications

Written by Angie Brown
Posted on January 7, 2025 at 9:17 AM

I sat at my desk contemplating the subject of this blog post, trace and space circuitry for printed circuit boards, and as usual, I drifted back to the start, for me, which was 1982. The date stamp amuses me – how is it 2024, already!? Of course, when you look back, you can’t stop the memories from flooding in.

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Achieving Flexibility: The Craft of Coiled Cable Assemblies

Written by Steven J Goodman
Posted on December 18, 2024 at 8:48 AM

In industries ranging from robotics to automotive to consumer electronics, flexibility is a crucial attribute of modern cable assemblies. Flexible cables enable compact routing, support dynamic motion, and enhance durability in challenging environments.

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Innovations in Custom Battery Pack Enclosures and Configurations

Written by Anton Beck
Posted on December 3, 2024 at 9:07 AM

Customers clearly understand the power needs of their applications that require a custom battery pack. They may also have narrowed down their choices in battery chemistry, placement of cells in the pack, the form of the cell, and battery management system (BMS) functions. Another important feature to consider is the battery enclosure.

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Using Equivalent Wire and Connectors to Save Time and Money – Q&A

Written by Epec Engineered Technologies
Posted on November 20, 2024 at 9:13 AM

At the conclusion of our webinar, Using Equivalent Wire and Connectors to Save Time and Money, we had several questions submitted to our presenter, Steven J. Goodman, User Interface & Cable Assembly Product Manager at Epec. We have compiled these questions into a readable format on our blog.

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An Introduction to Printed Circuit Board Markings

Written by Angie Brown
Posted on November 14, 2024 at 8:37 AM
Markings serve two main purposes on printed circuit boards - identification and traceability. Both types of markings are done to the specifications of our customers, but in the absence of specific requirements, our standard markings are applied.

In this post we will review these 2 types of markings and additional identification marks that can be incorporated into your printed circuit board.

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F1 Rating for Outdoor Plastic HMI Enclosures - UL 746C

Written by Steven J Goodman
Posted on October 30, 2024 at 8:18 AM

Outdoor-rated enclosures incorporate numerous technologies to stand up to the harsh conditions they must face. These technologies include waterproof keypads and membrane switches, custom silicone gasketing, and highly engineered raw materials such as weatherable ABS/PC blends that can be injection molded creating the custom enclosure shape.

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