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Epec's Blog | Electronics Manufacturing Solutions

Chris Perry

Chris Perry
Chris has been with Epec for almost two decades, including 8 years manufacturing experience within a quality control role and 2 years in the front end planning department. As a lab technician, Chris analyzed and maintained chemical processes within bare board manufacturing, while aiding with overall quality in all departments. He also monitored and maintained the company wastewater facility to comply with local environmental agencies. As Epec has grown, Chris has continued to accept new responsibilities within the company. Chris has also held the role of PCB planning, where he learned the entire process, through customer delivery. Chris has been certified through Addstan Management Systems as an ISO 9001:2000 Internal Auditor, and most recently received IPC-A-600 Certified IPC Specialist from Eptac Corporation. Chris received his A.S. degree in Environmental Science at Bristol College, was certified as Class III Industrial Wastewater operator, and also was certified as an emergency response operator.

Recent Posts


RoHS Compliance Standards Beyond High Tg PCB

Written by Chris Perry
Posted on December 27, 2016 at 2:02 PM

As a contract manufacturer, say you receive a new circuit board part to assemble that is 6-layers with a high micro-via count, has blind and buried vias, and a lead free HASL finish. The circuit board laminate requirement for meeting the Restriction of Hazardous Substances, or RoHS compliance, is strictly Glass Transition Temperature(Tg) 170.

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Understanding Bow and Twist of Printed Circuit Boards

Written by Chris Perry
Posted on December 15, 2016 at 10:20 AM

Bow and twist of printed circuit boards (PCB) routinely rank among the highest levels of falsely identified non-conformance because it is perhaps the least understood. Envisioning a perfectly flat rigid circuit board as the standard is a fallacy believed by many incoming inspectors. Understanding the reasons and causes for PCB bow and twist can help resolve the issue at the board design stage.

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Incoming Inspection of Printed Circuit Boards

Written by Chris Perry
Posted on June 30, 2016 at 1:30 PM

As printed circuit board (PCB) designs get more demanding with advances in technology involving complex footprints and added costs to components, incoming inspection of printed circuit boards must take higher priority.

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Managing Quality with Asian PCB Manufacturers

Written by Chris Perry
Posted on January 28, 2016 at 1:30 PM

There was a time when “Made in China” was synonymous with cheaper, poor quality products. "Buyer beware" was the common theme associated with outsourcing to any Asian PCB manufacturers. So how did Epec approach this challenge and succeed? It was by managing quality through intense auditing, training, and qualification. Epec understood at a very early stage that first-class quality products from Asian manufacturers would require consistent presence, training, and auditing.

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PCB Cleanliness Attention to Details

Written by Chris Perry
Posted on October 13, 2015 at 3:13 PM

Cleanliness of bare circuit boards increases in importance with advances in PCB technology that continue to decrease conductor spacing. Inorganic contamination within printed circuit board fabrication can lead to electrochemical migration. Electrochemical migration is the dissolution and movement of metal ions in presence of electric potential, which results in the growth of dendritic structures between anode and cathode. These dendritic growths, which were minimal over periods of time, were not a concern of "yesterdays" bare boards.

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Matte Finish vs Gloss Finish In PCB Solder Mask Design

Written by Chris Perry
Posted on March 27, 2015 at 9:47 AM

When creating your optimal circuit board design, one factor that must be considered is the solder mask and whether to go with matte finish solder mask or gloss finish mask for your final product. Usually, most designers don't specify their preference and end up leaving the decision to the PCB fabricator. Most fabricators will likely default to a gloss surface finish, the more popular choice of the two.

 

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V Score of Printed Circuit Boards in Arrays

Written by Chris Perry
Posted on January 14, 2015 at 3:17 PM

When designing PCBs in a multi-up array, most designers choose v-score (also referred to as v score, v cut, or v groove) as the singulation method over traditional rout and breakaway tabs. The benefits of v-scoring pcb range from effortless removal of parts from panel form to realized cost savings with better utilization of panel area. When designing circuit boards in array with v-scoring, there are two areas of concern - the angle of the cut, and the depth of the cut.

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The Use of Strain Relief with Rigid-Flex Printed Circuit Boards

Written by Chris Perry
Posted on November 12, 2014 at 10:13 AM

For rigid-flex printed circuit boards (PCBs), the space joining rigid material to flex material (Transition Zone) sometimes contains imperfections that, although acceptable, could impact effectiveness of the final part. Transition zone imperfections can include any of the following:

  • Adhesive squeeze-out
  • Protruding dielectric materials
  • Crazing
  • Haloing
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What Causes Circuit Board Blow Hole Defects?

Written by Chris Perry
Posted on July 3, 2014 at 2:19 PM

When a blow hole defect occurs during the assembly process as a result of the PCB card, the primary culprit tends to be entrapped moisture or air. With moisture, any non-plated and non-masked areas on a bare circuit board that expose internal laminate can be suspect to absorbing moisture. Absorption can occur either during the board fabrication process or from improper storage. Examples of highly suspect areas include non-plated drilled holes and routed features.

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Why Bake OSP Circuit Boards Before Use?

Written by Chris Perry
Posted on April 29, 2014 at 1:47 PM

It is not recommended to bake boards with an organic solderability preserve (OSP) surface finish. Although baking a printed circuit board with an organic solderability preserve finish can have negative consequences, the process itself can have positive performance in specific applications. OSP is a very thin protective layer of material placed over exposed copper, typically using a conveyorized process to protect the copper from tarnish.

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