Epec's Blog | Electronics Manufacturing Solutions

Generally pads are small round or square areas of copper which are normally used to make a connection to a component pin. If these pads are not sitting correctly or are lifted, it can cause the connection between the printed circuit board (PCB) and the component to fail.

[This post is a continuation of Selecting the Most Capable Supplier: Part 1]

In the second part of this post, we will discuss 3 specific processes that you should review to control manufacturing supplier quality management before starting to do business with them. As a customer, you need to know that every aspect of your order is managed with the utmost care in a process that is repeatable and accountable.

Printed circuit boards (PCBs) with immersion finishes such as electroless nickel immersion gold (ENIG), immersion tin, silver, and OSP are appealing because they are lead-free. However, if handled improperly, these materials are susceptible to oxidation and corrosion from exposure to moisture and humidity. This oxidation causes dewetting after soldering, which can lead to poor joints at assembly and ultimately lead to failure of the board.