Epec's Blog | Electronics Manufacturing Solutions

Engineering in most industries, still tends to be primarily dominated by males. When I first entered the field of Printed Circuit Board (PCB) engineering, it was a bit intimidating. This was because the men always outnumbered the women. I felt we were graded on separate standards "Men vs Women".

When creating your optimal circuit board design, one factor that must be considered is the solder mask and whether to go with matte finish solder mask or gloss finish mask for your final product. Usually, most designers don't specify their preference and end up leaving the decision to the PCB fabricator. Most fabricators will likely default to a gloss surface finish, the more popular choice of the two.

When designing PCBs in a multi-up array, most designers choose v-score (also referred to as v score, v cut, or v groove) as the singulation method over traditional rout and breakaway tabs. The benefits of v-scoring pcb range from effortless removal of parts from panel form to realized cost savings with better utilization of panel area. When designing circuit boards in array with v-scoring, there are two areas of concern - the angle of the cut, and the depth of the cut.

With the news of TTM and Viasystems merger, two of the last big three (Sanmina being the third) circuit board manufacturers joining together is certain to have wide ranging effects on the United States Printed Circuit Board industry. To start, each merger of companies this size are priced to include "synergies" between the two companies. The word synergy is code for closing facilities and cutting people to save money to pay for the acquisition.

In order for Epec or any PCB fabrication company to quote your circuit boards accurately and with minimum delays, it's important to supply a complete PCB data file set, using industry-standard file types. Before you look at getting your quote, learn what information you need to supply to ensure a smooth PCB fabrication process.

Wave soldering, the process of attaching electronic components to the printed circuit board (PCB), becomes increasingly difficult as pitch decreases. Pitch is the center-to-center spacing between the conductors on a PCB. So knowing that wave soldering becomes harder with lower pitch measurements, what is the minimum pitch distance you should maintain on circuit boards? With the appropriate controls, it is still possible to get a good result with pitches as low as 0.5mm (.0197"). Wave soldering defects can occur in pitches below 0.5mm, so we recommend this as the minimum pitch to wave solder a PCB.

When a blow hole defect occurs during the assembly process as a result of the PCB card, the primary culprit tends to be entrapped moisture or air. With moisture, any non-plated and non-masked areas on a bare circuit board that expose internal laminate can be suspect to absorbing moisture. Absorption can occur either during the board fabrication process or from improper storage. Examples of highly suspect areas include non-plated drilled holes and routed features.

When it comes to printed circuit board manufacturing, there are a variety of PCB via process requirements to consider. Each has their own pros, cons, and cost adders so knowing these requirements can aid you when designing your circuit boards. In this post we will discuss the differences for why you would either fill or plug a circuit board via.

It is not recommended to bake boards with an organic solderability preserve (OSP) surface finish. Although baking a printed circuit board with an organic solderability preserve finish can have negative consequences, the process itself can have positive performance in specific applications. OSP is a very thin protective layer of material placed over exposed copper, typically using a conveyorized process to protect the copper from tarnish.

Within the printed circuit board industry the term "tenting" originally indicated that the mask would fully enclose the via at one end by forming a skin or tent over the opening. While dry film solder mask is more expensive, it is capable of forming a reliable tent, while liquid photoimageable solder mask (LPI) generally will not.