<img height="1" width="1" style="display:none" src="https://www.facebook.com/tr?id=140460429997534&amp;ev=PageView&amp;noscript=1">

Epec's Blog | Electronics Manufacturing Solutions


V Score of Printed Circuit Boards in Arrays

Written by Chris Perry
Posted on January 14, 2015 at 3:17 PM

When designing PCBs in a multi-up array, most designers choose v-score (also referred to as v score, v cut, or v groove) as the singulation method over traditional rout and breakaway tabs. The benefits of v-scoring pcb range from effortless removal of parts from panel form to realized cost savings with better utilization of panel area. When designing circuit boards in array with v-scoring, there are two areas of concern - the angle of the cut, and the depth of the cut.

Read More  

What the TTM Viasystems Merger Means For the PCB Industry

Written by Ed McMahon
Posted on September 30, 2014 at 1:10 PM

With the news of TTM and Viasystems merger, two of the last big three (Sanmina being the third) circuit board manufacturers joining together is certain to have wide ranging effects on the United States Printed Circuit Board industry. To start, each merger of companies this size are priced to include "synergies" between the two companies. The word synergy is code for closing facilities and cutting people to save money to pay for the acquisition.

Read More  

PCB Fabrication Data File Requirements

Written by Al Wright
Posted on September 17, 2014 at 12:08 PM

In order for Epec or any PCB fabrication company to quote your circuit boards accurately and with minimum delays, it's important to supply a complete PCB data file set, using industry-standard file types. Before you look at getting your quote, learn what information you need to supply to ensure a smooth PCB fabrication process.

Read More  

PCB Wave Soldering And Minimum Pitch Distance

Written by Al Wright
Posted on August 7, 2014 at 2:46 PM

Wave soldering, the process of attaching electronic components to the printed circuit board (PCB), becomes increasingly difficult as pitch decreases. Pitch is the center-to-center spacing between the conductors on a PCB. So knowing that wave soldering becomes harder with lower pitch measurements, what is the minimum pitch distance you should maintain on circuit boards? With the appropriate controls, it is still possible to get a good result with pitches as low as 0.5mm (.0197"). Wave soldering defects can occur in pitches below 0.5mm, so we recommend this as the minimum pitch to wave solder a PCB.

Read More  

What Causes Circuit Board Blow Hole Defects?

Written by Chris Perry
Posted on July 3, 2014 at 2:19 PM

When a blow hole defect occurs during the assembly process as a result of the PCB card, the primary culprit tends to be entrapped moisture or air. With moisture, any non-plated and non-masked areas on a bare circuit board that expose internal laminate can be suspect to absorbing moisture. Absorption can occur either during the board fabrication process or from improper storage. Examples of highly suspect areas include non-plated drilled holes and routed features.

Read More  

Why Should You Fill or Plug A Circuit Board Via?

Written by Al Wright
Posted on June 20, 2014 at 2:53 PM

When it comes to printed circuit board manufacturing, there are a variety of PCB via process requirements to consider. Each has their own pros, cons, and cost adders so knowing these requirements can aid you when designing your circuit boards. In this post we will discuss the differences for why you would either fill or plug a circuit board via.

Read More  

Why Bake OSP Circuit Boards Before Use?

Written by Chris Perry
Posted on April 29, 2014 at 1:47 PM

It is not recommended to bake boards with an organic solderability preserve (OSP) surface finish. Although baking a printed circuit board with an organic solderability preserve finish can have negative consequences, the process itself can have positive performance in specific applications. OSP is a very thin protective layer of material placed over exposed copper, typically using a conveyorized process to protect the copper from tarnish.

Read More  

Why Is Via Tenting Required On A PCB?

Written by Chris Perry
Posted on January 28, 2014 at 12:42 PM

Within the printed circuit board industry the term "tenting" originally indicated that the mask would fully enclose the via at one end by forming a skin or tent over the opening. While dry film solder mask is more expensive, it is capable of forming a reliable tent, while liquid photoimageable solder mask (LPI) generally will not.

Read More  

How to Select Proper PCB Copper Thickness

Written by Al Wright
Posted on December 31, 2013 at 1:40 PM

Selecting the optimal heavy copper thickness to apply to the plated through hole (PTH) plays a critical factor towards the overall reliability of the printed circuit board. There are two key elements to consider when determining optimal PCB copper thickness. The first is the current capacity of the barrel for acceptable heat rise. The second is the mechanical strength determined by the copper thickness, hole-size and whether or not there are any support vias.

Read More  

What Causes Pad Lifting On Printed Circuit Boards?

Written by Chris Perry
Posted on November 8, 2013 at 2:19 PM

Generally pads are small round or square areas of copper which are normally used to make a connection to a component pin. If these pads are not sitting correctly or are lifted, it can cause the connection between the printed circuit board (PCB) and the component to fail.

Read More  
Subscribe to our blog Subscribe to our blog

Recent Posts



Quote Your PCB's Online

InstantPCBQuote - Online Quote and Ordering Solution for Rigid PCB's

Register today and start to quote and order your circuit boards online, 24/7.

Start Quoting Now

Need Help with A Project?

Request Design Support

Our team of engineers are here to help you with all your product needs.

Request Design Support