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Blog | Manufacturing Solutions

Paul Tome - Product Manager Flex & Rigid Flex

Paul Tome - Product Manager Flex & Rigid Flex
As Product Manager of Flex & Rigid-Flex Circuits, Paul oversees our entire flex & rigid-flex product line. Though Paul's main responsibility is customer technical support, he is involved in each project from the beginning conceptual stages to delivery. He works directly with customers on their specific design requirements and makes sure that each product is designed correctly, troubleshooting any issues that may arise in the process. Paul came to Epec with 24 years of a great variety of experience in the electronics industry. He has been involved in all aspects of the industry including sales, engineering, and manufacturing. He has worked with PCBs and equipment manufacturing and has also been the owner of an engineering service and trust bureau. Previously, he was president at Advanced Circuit Services. Paul's experience and expertise make him an indispensable part of Epec's team. Paul holds a mechanical engineering degree from Seneca College.

Recent Posts


Flex PCB Stackup Documentation

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on April 3, 2018 at 11:57 AM

The flex PCB stackup documentation is an important component of the data set of a flexible printed circuit board design. It consists of a description of a flex or rigid-flex circuit board that defines in detail the specific material requirements and construction of the design.

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Flex PCB EMI Shielding Methods and Materials

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on March 26, 2018 at 3:26 PM

Many electronics assemblies that utilize flexible printed circuit boards are sensitive to either absorbing or emitting electromagnetic interference (EMI). If EMI is left uncontrolled it can negatively impact the performance of the design and in extreme cases completely prevent it from functioning.

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Why Pre-Bake Flex PCB Prior To Assembly?

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on March 15, 2018 at 10:05 AM

The pre-baking of flex printed circuit boards (PCB) immediately prior to assembly is an industry standard requirement that is documented in IPC2223 sec 5.3.5, IPC-FA-251 sec. 3.2.1.1.2 and by material suppliers (i.e. DuPont Pyralux Technical Manual sec. 5.23). This applies to all polyimide-based flex and rigid–flex designs. But why is pre-baking done prior to assembly, rather than earlier in the circuit board manufacturing stage?

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Common Flex Circuit Technical Issues That Delay Quick Turn Orders

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on March 6, 2018 at 2:20 PM

When ordering flex circuit boards online, quick turn order delivery timelines can incur setbacks if the data set is either incomplete or if the design has technical issues. Technical issues can be related to either manufacturability or the end use of the parts. These issues then often require multiple communications to resolve and in some worst-case scenarios, extensive design revision. Any of these issues will of course delay the delivery of the finished parts.

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5 Questions To Ask Your Flex Circuit Supplier

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on June 27, 2017 at 9:58 AM

Flex circuit suppliers come in a variety of different sizes and stages of financial integrity. Choosing the one that will perform the best for your requirements is an important element to the success of you application. Knowing what questions to ask your flex circuit supplier is essential in choosing who will be manufacturing your flex circuits.

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What It Takes to Manufacture Flexible PCBs

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on June 22, 2017 at 12:15 PM

For every flexible circuit board manufacturer, there are some key areas you should be aware of. While flex circuits have some similar characteristics to rigid printed circuit boards, they require very different approaches in the manufacturing process.

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The Purpose of a Flex Circuit Stiffener

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on June 7, 2017 at 9:05 AM

In the world of flexible circuit boards, stiffeners are a common requirement in a lot of flex designs. By definition, a circuit board stiffener provides a mechanical support function and is not part of the electrical schematic of a design.

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IPC PCB Design Standards Violations in Rigid-Flex PCBs

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on May 25, 2017 at 10:50 AM

It is critical for any flex circuit design to be free of errors and violations in order to get the application to market as fast as possible without unnecessary delay. To help designers avoid common IPC PCB design standards violations in rigid-flex PCBs, this blog post will discuss three of the most common IPC Association Connecting Electronics Industries design violations.

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Why Flex and Rigid-Flex PCB Tooling Costs More than Rigid PCBs

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on May 17, 2017 at 9:32 AM

One question we get asked frequently is: "Why does flex and rigid-flex PCB tooling cost more than rigid PCBs?" The answer is quite simple; flex circuit tooling is a much more complex process than standard printed circuit boards.

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Flex Circuit Polyimide Coverlay & Solder Mask Considerations

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on November 2, 2016 at 3:34 PM

Previously, we gave you the definition for flexible circuit coverlay. Now, we go into greater depth discussing the two primary options for encapsulating the external circuit layers of a flex circuit:  polyimide coverlay and flexible liquid photoimageable (LPI) solder mask. The two materials have very different capabilities and requirements.

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