--- title: Epec's Blog | Paul Tome (4) description: "As Product Manager of Flex & Rigid-Flex Circuits, Paul oversees our entire flex & rigid-flex product line. Though Paul's main responsibility is customer technical support, he is involved in each project from the beginning conceptual stages to delivery. He works directly with customers on their specific design requirements and makes sure that each product is designed correctly, troubleshooting any issues that may arise in the process.\n\nPaul came to Epec with 24 years of a great variety of experience in the electronics industry. He has been involved in all aspects of the industry including sales, engineering, and manufacturing. He has worked with PCBs and equipment manufacturing and has also been the owner of an engineering service and trust bureau.\n\nPreviously, he was president at Advanced Circuit Services. Paul's experience and expertise make him an indispensable part of Epec's team.\n\nPaul holds a mechanical engineering degree from Seneca College. 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[Register](https://secure.epecpcb.com/epec/index2.jsp) [![](https://www.epectec.com/images/InstantPCBQuote-logo.png)](https://www.epectec.com/instantpcbquote/) [Login](https://secure.epecpcb.com/epec/) [Register](https://secure.epecpcb.com/epec/index2.jsp) Register to Quote and Order Your PCBs Fast, Easy & Online, 24/7 - [Home](https://www.epectec.com/) - [Blog](https://blog.epectec.com/) - Paul Tome Share This Page: [LinkedIn](https://blog.epectec.com/#linkedin) [X](https://blog.epectec.com/#x) [Facebook](https://blog.epectec.com/#facebook) [Email](https://blog.epectec.com/#email) # Epec's Blog | Electronics Manufacturing Solutions ![Paul Tome](https://blog.epectec.com/hubfs/Blog-Authors/paul-tome.jpg "Paul Tome") ## Paul Tome As Product Manager of Flex & Rigid-Flex Circuits, Paul oversees our entire flex & rigid-flex product line. Though Paul's main responsibility is customer technical support, he is involved in each project from the beginning conceptual stages to delivery. He works directly with customers on their specific design requirements and makes sure that each product is designed correctly, troubleshooting any issues that may arise in the process. Paul came to Epec with 24 years of a great variety of experience in the electronics industry. He has been involved in all aspects of the industry including sales, engineering, and manufacturing. He has worked with PCBs and equipment manufacturing and has also been the owner of an engineering service and trust bureau. Previously, he was president at Advanced Circuit Services. Paul's experience and expertise make him an indispensable part of Epec's team. Paul holds a mechanical engineering degree from Seneca College. ### Recent Posts --- ## [Design Comparison: Flex Circuit with Stiffeners vs. Rigid-Flex PCB](https://blog.epectec.com/design-comparison-flex-circuit-with-stiffeners-vs-rigid-flex-pcb) [![Flexible circuit board designed with stiffeners](https://blog.epectec.com/hubfs/Blog/flexible-circuit-board-designed-with-stiffeners.jpg "Flexible circuit board designed with stiffeners")](https://blog.epectec.com/design-comparison-flex-circuit-with-stiffeners-vs-rigid-flex-pcb) Written by [Paul Tome](https://blog.epectec.com/author/paul-tome) Posted on April 2, 2019 at 10:49 AM - [Tweet](https://twitter.com/share) When developing a [flex PCB based design](https://www.epectec.com/flex/design/), one of the most common early decisions is whether a flex circuit with stiffener(s) will meet the design requirements or if a rigid-flex construction is necessary or more effective. While there is some overlap between the two methodologies, there are significant capability, performance, and cost differences that require review to ensure a successful design. [Read More](https://blog.epectec.com/design-comparison-flex-circuit-with-stiffeners-vs-rigid-flex-pcb) --- ## [Integrating Flex with Rigid PCB to Improve Design](https://blog.epectec.com/integrating-flex-with-rigid-pcb-to-improve-design) [![Rigid-Flex PCB with no Points of Interconnect](https://blog.epectec.com/hubfs/Blog/rigid-flex-pcb-with-no-points-of-interconnect.jpg "Rigid-Flex PCB with no Points of Interconnect")](https://blog.epectec.com/integrating-flex-with-rigid-pcb-to-improve-design) Written by [Paul Tome](https://blog.epectec.com/author/paul-tome) Posted on March 27, 2019 at 9:49 AM - [Tweet](https://twitter.com/share) Integrating flex circuits with rigid PCBs in a [rigid-flex configuration](https://www.epectec.com/articles/how-rigid-flex-pcb-design-configurations-are-advancing.html) helps address common design challenges by combining the mechanical advantages of flex circuitry with the functionality of rigid circuit board sections. [Read More](https://blog.epectec.com/integrating-flex-with-rigid-pcb-to-improve-design) --- ## [How to Specify Stiffener Requirements in Flex PCB Design Drawings](https://blog.epectec.com/how-to-specify-stiffener-requirements-in-flex-pcb-design-drawings) [![Flex Circuit with Connector Area Support Stiffeners](https://blog.epectec.com/hubfs/Blog/flex-circuit-with-connector-area-support-stiffener.jpg "Flex Circuit with Connector Area Support Stiffeners")](https://blog.epectec.com/how-to-specify-stiffener-requirements-in-flex-pcb-design-drawings) Written by [Paul Tome](https://blog.epectec.com/author/paul-tome) Posted on March 14, 2019 at 1:39 PM - [Tweet](https://twitter.com/share) [Stiffeners](https://www.epectec.com/flex/flex-circuit-stiffeners.html) are a critical element in [flex circuit design](https://www.epectec.com/flex/design/) and directly influence the performance, reliability, and manufacturability of the finished product. Properly specified stiffeners provide support for component and connector areas, help meet ZIF connector requirements, address mechanical bend constraints, and can assist with heat dissipation. Complete and accurate documentation is essential to ensure the finished flex circuit meets design requirements. [Read More](https://blog.epectec.com/how-to-specify-stiffener-requirements-in-flex-pcb-design-drawings) --- ## [Differences of Via in Pad Technology in Flex Circuits vs Rigid PCBs](https://blog.epectec.com/differences-of-via-in-pad-technology-in-flex-circuits-vs-rigid-pcbs) [![Complex Rigid-Flex Circuit Board](https://blog.epectec.com/hubfs/Blog/complex-rigid-flex-circuit-board.jpg "Complex Rigid-Flex Circuit Board")](https://blog.epectec.com/differences-of-via-in-pad-technology-in-flex-circuits-vs-rigid-pcbs) Written by [Paul Tome](https://blog.epectec.com/author/paul-tome) Posted on March 5, 2019 at 10:52 AM - [Tweet](https://twitter.com/share) Many of today’s [rigid-flex circuit designs](https://www.epectec.com/flex/design/) utilize the same high-density components found in rigid PCB designs. This requires the use of [blind and or buried vias](https://blog.epectec.com/pcb-vias-everything-you-need-to-know) to allow the signal lines to be routed out from within the high-density components or the high-density areas of the design. The most common component that we see driving this today is the 0.4mm pitch BGA package. [Read More](https://blog.epectec.com/differences-of-via-in-pad-technology-in-flex-circuits-vs-rigid-pcbs) --- ## [Flex PCB Stack-up Documentation](https://blog.epectec.com/flex-pcb-stackup-documentation) [![Flex Circuit Drawing with Multiple Area Material Stackup](https://blog.epectec.com/hubfs/Blog/example-of-flex-circuit-drawing-with-multiple-area-material-stack-up.jpg "Flex Circuit Drawing with Multiple Area Material Stackup")](https://blog.epectec.com/flex-pcb-stackup-documentation) Written by [Paul Tome](https://blog.epectec.com/author/paul-tome) Posted on April 3, 2018 at 11:57 AM - [Tweet](https://twitter.com/share) The flex PCB stack-up documentation is an important component of the data set of a flexible printed circuit board design. It consists of a description of a [flex or rigid-flex circuit board](https://www.epectec.com/flex/) that defines in detail the specific material requirements and construction of the design. [Read More](https://blog.epectec.com/flex-pcb-stackup-documentation) --- ## [Flex PCB EMI Shielding Methods and Materials](https://blog.epectec.com/flex-pcb-emi-shielding-methods-and-materials) [![2-Layer Flex PCB with Shield Film Layers](https://blog.epectec.com/hubfs/Blog/2-layer-flex-circuit-with-shield-film-layers.jpg "2-Layer Flex PCB with Shield Film Layers")](https://blog.epectec.com/flex-pcb-emi-shielding-methods-and-materials) Written by [Paul Tome](https://blog.epectec.com/author/paul-tome) Posted on March 26, 2018 at 3:26 PM - [Tweet](https://twitter.com/share) Many [electronics assemblies that utilize flexible printed circuit boards](https://www.epectec.com/flex/) are sensitive to either absorbing or emitting electromagnetic interference (EMI). If EMI is left uncontrolled it can negatively impact the performance of the design and in extreme cases completely prevent it from functioning. [Read More](https://blog.epectec.com/flex-pcb-emi-shielding-methods-and-materials) --- ## [Why Pre-Bake Flex PCB Prior To Assembly?](https://blog.epectec.com/why-pre-bake-flex-pcb-prior-to-assembly) [![Delamination Between FR4 Stiffener and Flex Circuit](https://blog.epectec.com/hubfs/Blog/example-of-delamination-between-fr4-stiffener-and-flex-circuit.jpg "Delamination Between FR4 Stiffener and Flex Circuit")](https://blog.epectec.com/why-pre-bake-flex-pcb-prior-to-assembly) Written by [Paul Tome](https://blog.epectec.com/author/paul-tome) Posted on March 15, 2018 at 10:05 AM - [Tweet](https://twitter.com/share) [Pre-baking polyimide-based flex PCBs](https://www.epectec.com/flex/pre-bake-specifications.html) immediately prior to assembly is required to prevent moisture-driven delamination during reflow. Polyimide materials naturally absorb moisture, which expands into steam under high temperatures and separates layers. Removing this moisture just before assembly is the only reliable way to avoid failures. [Read More](https://blog.epectec.com/why-pre-bake-flex-pcb-prior-to-assembly) --- ## [Common Flex Circuit Technical Issues That Delay Quick Turn Orders](https://blog.epectec.com/common-flex-circuit-technical-issues-that-delay-quick-turn-orders) [![Custom manufactured flexible circuit boards](https://blog.epectec.com/hubfs/Blog/custom-manufactured-flexible-circuit-board.jpg "Custom manufactured flexible circuit boards")](https://blog.epectec.com/common-flex-circuit-technical-issues-that-delay-quick-turn-orders) Written by [Paul Tome](https://blog.epectec.com/author/paul-tome) Posted on March 6, 2018 at 2:20 PM - [Tweet](https://twitter.com/share) When [ordering flex circuit boards online](https://www.epectec.com/instantflexquote/), quick turn order delivery timelines can incur setbacks if the data set is either incomplete or if the design has technical issues. Technical issues can be related to either manufacturability or the end use of the parts. These issues then often require multiple communications to resolve and in some worst-case scenarios, extensive design revision. Any of these issues will of course delay the delivery of the finished parts. [Read More](https://blog.epectec.com/common-flex-circuit-technical-issues-that-delay-quick-turn-orders) --- ## [5 Questions To Ask Your Flex Circuit Supplier](https://blog.epectec.com/5-questions-to-ask-your-flex-circuit-supplier) [![Flexible circuit during manufacturing](https://blog.epectec.com/hubfs/Blog/flexible-circuit-during-manufacturing.jpg "Flexible circuit during manufacturing")](https://blog.epectec.com/5-questions-to-ask-your-flex-circuit-supplier) Written by [Paul Tome](https://blog.epectec.com/author/paul-tome) Posted on June 27, 2017 at 9:58 AM - [Tweet](https://twitter.com/share) [Flex circuit suppliers](https://www.epectec.com/flex/) vary widely in experience, capabilities, and financial stability. Choosing the right partner is critical to the success of your application. A structured vetting process helps ensure that your supplier can support [design requirements](https://www.epectec.com/flex/design/), manufacturing constraints, and long-term production goals. The following five questions identify the most important areas to evaluate when selecting a flex circuit supplier. [Read More](https://blog.epectec.com/5-questions-to-ask-your-flex-circuit-supplier) --- ## [What It Takes to Manufacture Flexible PCBs](https://blog.epectec.com/what-it-takes-to-manufacture-flexible-pcbs) [![Pad Plate Method](https://blog.epectec.com/hubfs/Blog/pad-plate-method.jpg "Pad Plate Method")](https://blog.epectec.com/what-it-takes-to-manufacture-flexible-pcbs) Written by [Paul Tome](https://blog.epectec.com/author/paul-tome) Posted on June 22, 2017 at 12:15 PM - [Tweet](https://twitter.com/share) [Flexible circuits](https://www.epectec.com/flex/) share some characteristics with [rigid printed circuit boards](https://www.epectec.com/pcb/), but the manufacturing approach is fundamentally different. The thinness and lack of reinforcement in flex materials introduce unique challenges that affect handling, processing, and dimensional control. [Read More](https://blog.epectec.com/what-it-takes-to-manufacture-flexible-pcbs) [Previous](https://blog.epectec.com/author/paul-tome/page/3) | [All posts](https://blog.epectec.com/all) | [Next](https://blog.epectec.com/author/paul-tome/page/5) --- ### Recent Posts --- ### Posts by Topic - [Printed Circuit Boards (162)](https://blog.epectec.com/topic/printed-circuit-boards) - [Product Design (138)](https://blog.epectec.com/topic/product-design) - [Battery Packs (122)](https://blog.epectec.com/topic/battery-packs) - [Cable Assemblies (102)](https://blog.epectec.com/topic/cable-assemblies) - [Flex & Rigid-Flex PCB's (95)](https://blog.epectec.com/topic/flex-rigid-flex-pcbs) - [Electronics Industry (61)](https://blog.epectec.com/topic/electronics-industry) - [User Interfaces (55)](https://blog.epectec.com/topic/user-interfaces) - [Quality Solutions (33)](https://blog.epectec.com/topic/quality-solutions) - [Flexible Heaters (31)](https://blog.epectec.com/topic/flexible-heaters) - [Events, Training, and Support (9)](https://blog.epectec.com/topic/events-training-and-support) - [RF Products (7)](https://blog.epectec.com/topic/rf-products) - [CNC Machining (3)](https://blog.epectec.com/topic/cnc-machining) - [Fans & Motors (1)](https://blog.epectec.com/topic/fans-motors) See All --- --- ### Need Help with A Project? 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