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Epec's Blog | Electronics Manufacturing Solutions


Common Flex Circuit Technical Issues That Delay Quick Turn Orders

Written by Paul Tome
Posted on March 6, 2018 at 2:20 PM

When ordering flex circuit boards online, quick turn order delivery timelines can incur setbacks if the data set is either incomplete or if the design has technical issues. Technical issues can be related to either manufacturability or the end use of the parts. These issues then often require multiple communications to resolve and in some worst-case scenarios, extensive design revision. Any of these issues will of course delay the delivery of the finished parts.

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5 Questions To Ask Your Flex Circuit Supplier

Written by Paul Tome
Posted on June 27, 2017 at 9:58 AM

Flex circuit suppliers come in a variety of different sizes and stages of financial integrity. Choosing the one that will perform the best for your requirements is an important element to the success of you application. Knowing what questions to ask your flex circuit supplier is essential in choosing who will be manufacturing your flex circuits.

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What It Takes to Manufacture Flexible PCBs

Written by Paul Tome
Posted on June 22, 2017 at 12:15 PM

For every flexible circuit board manufacturer, there are some key areas you should be aware of. While flex circuits have some similar characteristics to rigid printed circuit boards, they require very different approaches in the manufacturing process.

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The Purpose of a Flex Circuit Stiffener

Written by Paul Tome
Posted on June 7, 2017 at 9:05 AM

In the world of flexible circuit boards, stiffeners are a common requirement in a lot of flex designs. By definition, a circuit board stiffener provides a mechanical support function and is not part of the electrical schematic of a design.

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3 Key Requirements for Your Offshore Rigid-Flex PCB Manufacturer

Written by Ed McMahon
Posted on June 1, 2017 at 3:14 PM

Today, there are well over 3,000 companies that manufacturer printed circuit boards (PCB) in Asia (China, Taiwan, Japan, India, Korea, Thailand)  with the supply capacity continuing to grow well ahead of the global demand.

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IPC PCB Design Standards Violations in Rigid-Flex PCBs

Written by Paul Tome
Posted on May 25, 2017 at 10:50 AM

It is critical for any flex circuit design to be free of errors and violations in order to get the application to market as fast as possible without unnecessary delay. To help designers avoid common IPC PCB design standards violations in rigid-flex PCBs, this blog post will discuss three of the most common IPC Association Connecting Electronics Industries design violations.

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Why Flex and Rigid-Flex PCB Tooling Costs More than Rigid PCBs

Written by Paul Tome
Posted on May 17, 2017 at 9:32 AM

One question we get asked frequently is: "Why does flex and rigid-flex PCB tooling cost more than rigid PCBs?" The answer is quite simple; flex circuit tooling is a much more complex process than standard printed circuit boards.

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Flex Circuit Polyimide Coverlay & Solder Mask Considerations

Written by Paul Tome
Posted on November 2, 2016 at 3:34 PM

Previously, we gave you the definition for flexible circuit coverlay. Now, we go into greater depth discussing the two primary options for encapsulating the external circuit layers of a flex circuit:  polyimide coverlay and flexible liquid photoimageable (LPI) solder mask. The two materials have very different capabilities and requirements.

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Rigid-Flex PCB Gerber Layout Requirements

Written by Paul Tome
Posted on August 16, 2016 at 4:07 PM

Rigid-flex printed circuit boards are unique in terms of integrated construction of both rigid and flex circuit technologies. Unique construction comes with unique requirements that should be reviewed and implemented during the rigid-flex PCB Gerber layout phase of the design process.

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Common Flex & Rigid-Flex PCB Constructions

Written by Paul Tome
Posted on May 27, 2016 at 10:30 AM

Flex and rigid-flex PCB constructions have many variations that allow for a wide range of applications and solutions. A significant difference to rigid PCB constructions is that uneven layer counts are allowed and frequently used. The primary reasons being reduced flex thickness, improved flexibility and reduced part cost.

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