Epec's Blog | Electronics Manufacturing Solutions

When designing PCBs in a multi-up array, most designers choose v-score (also referred to as v score, v cut, or v groove) as the singulation method over traditional rout and breakaway tabs. The benefits of v-scoring pcb range from effortless removal of parts from panel form to realized cost savings with better utilization of panel area. When designing circuit boards in array with v-scoring, there are two areas of concern - the angle of the cut, and the depth of the cut.

Over the past several years, the label "hybrid supplier" has become more popular among industry leading product and service companies. The term means combining multiple business elements with a unique process to create a mixture suited to fulfill all of a customer's needs under one company. While this sounds like a very attractive business model for a customer to use, it is much harder than it sounds.

For rigid-flex printed circuit boards (PCBs), the space joining rigid material to flex material (Transition Zone) sometimes contains imperfections that, although acceptable, could impact effectiveness of the final part. Transition zone imperfections can include any of the following:

Selecting the right battery pack cell type requires balancing electrical requirements, physical constraints, cost, and chemistry performance. Each chemistry, such as lithium-ion, LiFePO4, or NiMH, offers different tradeoffs in energy density, cycle life, and safety.

Working with an experienced battery pack manufacturer ensures the optimal combination of performance, reliability, and cost for your application.

With the news of TTM and Viasystems merger, two of the last big three (Sanmina being the third) circuit board manufacturers joining together is certain to have wide ranging effects on the United States Printed Circuit Board industry. To start, each merger of companies this size are priced to include "synergies" between the two companies. The word synergy is code for closing facilities and cutting people to save money to pay for the acquisition.

Accurate PCB fabrication begins with a complete and standardized data package. The preferred format is Gerber Extended (RS274X), which should be configured as the default output in the CAD system. This format is used directly for artwork plotting and avoids the interpretation issues that can arise with other file types.

Cable pre-molding, sometimes associated with potting or encapsulation, is used to protect the termination points from the surrounding environment.  Pre-molding involves the application of a material around the back section of a connector where the termination points are located.

Wave soldering, the process of attaching electronic components to the printed circuit board (PCB), becomes increasingly difficult as pitch decreases. Pitch is the center-to-center spacing between the conductors on a PCB. So, knowing that wave soldering becomes harder with lower pitch measurements, what is the minimum pitch distance you should maintain on circuit boards? With the appropriate controls, it is still possible to get a good result with pitches as low as 0.5mm (.0197"). Wave soldering defects can occur in pitches below 0.5mm, so we recommend this as the minimum pitch to wave solder a PCB.

The copper weight and corresponding thickness used in a flexible circuit board need to be carefully selected in order to meet both the electrical and mechanical bend requirements of specific flex circuit design. Copper weight for a flex PCB is both the stiffest and most critical component.

When a blow hole defect occurs during the assembly process as a result of the PCB card, the primary culprit tends to be entrapped moisture or air. With moisture, any non-plated and non-masked areas on a bare circuit board that expose internal laminate can be suspect to absorbing moisture. Absorption can occur either during the board fabrication process or from improper storage. Examples of highly suspect areas include non-plated drilled holes and routed features.