Epec's Blog | Electronics Manufacturing Solutions

The copper weight and corresponding thickness used in a flexible circuit board need to be carefully selected in order to meet both the electrical and mechanical bend requirements of specific flex circuit design. Copper weight for a flex PCB is both the stiffest and most critical component.

When a blow hole defect occurs during the assembly process as a result of the PCB card, the primary culprit tends to be entrapped moisture or air. With moisture, any non-plated and non-masked areas on a bare circuit board that expose internal laminate can be suspect to absorbing moisture. Absorption can occur either during the board fabrication process or from improper storage. Examples of highly suspect areas include non-plated drilled holes and routed features.

When it comes to printed circuit board manufacturing, there are a variety of PCB via process requirements to consider. Each has their own pros, cons, and cost adders so knowing these requirements can aid you when designing your circuit boards. In this post we will discuss the differences for why you would either fill or plug a circuit board via.

The major difference between a stranded cable and solid cable is the flexibility. Within this post we will define cable flexibility with regard to ability to withstand continuous movement. Depending on your application, cable flexibility can be a factor when choosing the proper components for your cable assembly or wire harness.

The need to protect your keypad from the ever-present threat of wear-and-tear is crucial for all applications.  If your control panel is going to be used in marine environments, medical devices, or other consumer electronics, the threat of water or liquid exposure is ever present. In wet situations, it is critical that all electronic components are completely sealed off from any outside substances that could damage the device.

It is not recommended to bake boards with an organic solderability preserve (OSP) surface finish. Although baking a printed circuit board with an organic solderability preserve finish can have negative consequences, the process itself can have positive performance in specific applications. OSP is a very thin protective layer of material placed over exposed copper, typically using a conveyorized process to protect the copper from tarnish.

The shelf life of a rechargeable nickel metal hydride (NiMH) battery will vary depending on the storage temperature and the size of any attached load. The battery shelf life will also vary by manufacturer. Panasonic recommends the following for their NiMH battery cells.

In the flexible printed circuit board manufacturing process, a flex circuit coverlay (aka coverfilm) is used to encapsulate and protect the external circuitry of a flexible circuit board.

A flexible circuit coverlay serves the exact same function as solder mask that is used on a rigid printed circuit board. The difference with a flex coverlay is the needed element of flexibility and durability it provides to the flex PCB design.

Many applications would be better suited using a membrane switch (low profile, flat surface keypad assembly) along with a rigid printed circuit board (PCB), replacing screen-printed silver conductors on polyester sheets.

Printed circuit boards with gold plated switch contact pads and gold plated dome switches greatly improve the reliability of your application, offering longer operating life with lower switch resistance and contact bounce.

Determining the cost of a battery pack with fuel gauge technology will vary depending on the accuracy of the battery fuel gauge required. The overall size of the battery pack will also have an effect on the final cost. For example, if a high-accuracy gauge is required on a small multi-cell battery, it could potentially double the cost. The good news is that the cost of battery cells become relatively small when factoring in the added value received from implementing a fuel gauge.