Epec's Blog | Electronics Manufacturing Solutions

Not all printed circuit board (PCB) materials are created equal. In fact, to say there is an equivalent for any is untrue. Although, they are all in line with each other for basic attributes and are close but not exact. These many different flavors are also not always available; some come with a steep cost, a high Minimum Order Quantity (MOQ,) and a long lead time.

When machines operate, they generate internal heat that may compromise working components. The same situation holds true for battery cells. Cells undergo a chemical process that provides power to devices.

There are several reasons for the need to plug printed circuit board (PCB) holes. Some of the most commonly seen reasons include properly tenting or covering the via with solder mask (isolation), to prevent entrapment (solder, chemistry, flux), to prevent solder starvation (wicking of solder in the hole/surface mount technology (SMT) placement directly on via), and for thermal or electrical purposes.

When designing a custom cable assembly, it can be more in-depth than you would initially think. All you have to do is make connections, right? What could be intricate about that? If care is not taken during the design process, it could lead to unintentional failures or incorrect functionality down the line.

At the conclusion of our webinar, Why High-Tech Multi-Layer PCB Features Add Cost and Processing Time, we had several questions submitted to our presenter, Angie Brown, PCB Product Manager at Epec. We have compiled these questions into a readable format on our blog.

When it comes to manufacturing printed circuit boards (PCB), providing your PCB supplier with a clean data package can decrease cycle time and ensure requirements are clearly understood.

Flexibility is a critical element in most flexible circuit board designs. Whether it’s to meet a tight “one-time bend-to-fit” application or a “dynamic” infinite bend cycle application. To meet these requirements, a flex circuit design must be kept as thin as practically possible, use the correct copper type, and utilize the correct copper plating process.

As the printed circuit board’s physical size became smaller in one or both directions, it quickly became an issue for both the raw PCB supplier and the contract manufacturer to manage the parts on certain equipment. Processes like routing, electrical test, and packaging added cost to production for either time or scrap. Fallout was an issue that recovery was not possible.

The purpose of IPC specification is to provide requirements for qualification and performance of rigid printed circuit boards based on the following constructions and/or technologies. These requirements apply to the finished product unless otherwise specified.

When we look at where we are today vs. 1980 or earlier with technology, it is truly amazing. Just think about an appliance, for example, the household refrigerator/freezer. It used to be that you opened the door, looked inside, found what was needed, and closed it. I can hear my parents yelling, “shut the door,” like all the cold is coming out and everything will spoil. Settings were cold/coldest on a dial you turned.