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Epec's Blog | Electronics Manufacturing Solutions


What is a Flexible Circuit Coverlay?

Written by Paul Tome
Posted on March 14, 2014 at 2:45 PM

In the flexible printed circuit board manufacturing process, a flex circuit coverlay (aka coverfilm) is used to encapsulate and protect the external circuitry of a flexible circuit board.

A flexible circuit coverlay serves the exact same function as solder mask that is used on a rigid printed circuit board. The difference with a flex coverlay is the needed element of flexibility and durability it provides to the flex PCB design.

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Why Use A PCB Membrane Switch Combination?

Written by Epec Engineered Technologies
Posted on March 3, 2014 at 12:33 PM

Many applications would be better suited using a membrane switch (low profile, flat surface keypad assembly) along with a rigid printed circuit board (PCB), replacing screen-printed silver conductors on polyester sheets.

Printed circuit boards with gold plated switch contact pads and gold plated dome switches greatly improve the reliability of your application, offering longer operating life with lower switch resistance and contact bounce.

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How A Battery Pack Fuel Gauge Impacts Cost

Written by Anton Beck
Posted on February 14, 2014 at 11:44 AM

Determining the cost of a battery pack with fuel gauge technology will vary depending on the accuracy of the battery fuel gauge required. The overall size of the battery pack will also have an effect on the final cost. For example, if a high-accuracy gauge is required on a small multi-cell battery, it could potentially double the cost. The good news is that the cost of battery cells become relatively small when factoring in the added value received from implementing a fuel gauge.

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Why Is Via Tenting Required On A PCB?

Written by Chris Perry
Posted on January 28, 2014 at 12:42 PM

Within the printed circuit board industry the term "tenting" originally indicated that the mask would fully enclose the via at one end by forming a skin or tent over the opening. While dry film solder mask is more expensive, it is capable of forming a reliable tent, while liquid photoimageable solder mask (LPI) generally will not.

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What Is The Smallest Bend Radius Of A Membrane Switch Tail?

Written by Epec Engineered Technologies
Posted on January 15, 2014 at 2:41 PM

The smallest bend radius that can be used on a membrane switch tail will depend on the type of design. Deciding factors will depend whether or not the user interface is constructed with one tail/circuit layer or dual tail/circuit layers, and where the bend is located.

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How to Select Proper PCB Copper Thickness

Written by Al Wright
Posted on December 31, 2013 at 1:40 PM

Selecting the optimal heavy copper thickness to apply to the plated through hole (PTH) plays a critical factor towards the overall reliability of the printed circuit board. There are two key elements to consider when determining optimal PCB copper thickness. The first is the current capacity of the barrel for acceptable heat rise. The second is the mechanical strength determined by the copper thickness, hole-size and whether or not there are any support vias.

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What Is An Overmolded Cable Assembly?

Written by Epec Engineered Technologies
Posted on December 3, 2013 at 12:39 PM

Overmolded cables are full assemblies that seamlessly combine the wire and the connector into a single part. The process of overmolding a cable involves injecting a molten material into a mold cavity, which conforms to the desired shape when cooled. The mold cavity can be built as a simple design with no markings or as a more complex design if you wanted to include a company name, corporate logo, flanges to be used as attachment points, or an extended strain relief area.

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What Causes Pad Lifting On Printed Circuit Boards?

Written by Chris Perry
Posted on November 8, 2013 at 2:19 PM

Generally pads are small round or square areas of copper which are normally used to make a connection to a component pin. If these pads are not sitting correctly or are lifted, it can cause the connection between the printed circuit board (PCB) and the component to fail.

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Battery Pack Development Timeline: Concept Through Production

Written by Anton Beck
Posted on October 21, 2013 at 10:37 AM

This is a brief overview of how our custom battery pack development process works here at Epec. The actual completion time of the development of a custom battery pack will vary depending on the requirements of the application itself. Understanding each of the necessary stages and length estimates of concept through production will help you become prepared leading up to development.

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Preventing Switch Bounce in Low-profile Keypad Assemblies

Written by Epec Engineered Technologies
Posted on October 10, 2013 at 2:10 PM

Custom low-profile keypad assemblies used in OEM applications incorporate snap-acting dome switches. Dome switches are a type of keypad assembly switch intended for very long cycle life and years of trouble-free use but are intended for logic-level switching, not power switching.

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