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Blog | Manufacturing Solutions


Why Bake OSP Circuit Boards Before Use?

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on April 29, 2014 at 1:47 PM

It is not recommended to bake boards with an Organic Solderability Preserve (OSP) finish. Although baking a printed circuit board with an organic solderability preserve finish can have negative consequences, the process itself can have positive performance in specific applications. OSP is a very thin protective layer of material placed over exposed copper, typically using a conveyorized process to protect the copper from tarnish.

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What Causes Pad Lifting On Printed Circuit Boards?

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on November 8, 2013 at 2:19 PM

Generally pads are small round or square areas of copper which are normally used to make a connection to a component pin. If these pads are not sitting correctly or are lifted, it can cause the connection between the printed circuit board (PCB) and the component to fail.

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Proper Handling of Immersion PCB Surface Finishes

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on March 21, 2013 at 10:35 AM

Printed circuit boards (PCBs) with immersion finishes such as electroless nickel immersion gold (ENIG), immersion tin, silver, and OSP are appealing because they are lead-free. However, when handled improperly, these materials are susceptible to oxidation and corrosion from exposure to moisture and humidity. This oxidation causes dewetting after soldering, which can lead to poor joints at assembly and ultimately lead to failure of the board.

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