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Epec's Blog | Electronics Manufacturing Solutions

Paul Tome

Paul Tome
As Product Manager of Flex & Rigid-Flex Circuits, Paul oversees our entire flex & rigid-flex product line. Though Paul's main responsibility is customer technical support, he is involved in each project from the beginning conceptual stages to delivery. He works directly with customers on their specific design requirements and makes sure that each product is designed correctly, troubleshooting any issues that may arise in the process. Paul came to Epec with 24 years of a great variety of experience in the electronics industry. He has been involved in all aspects of the industry including sales, engineering, and manufacturing. He has worked with PCBs and equipment manufacturing and has also been the owner of an engineering service and trust bureau. Previously, he was president at Advanced Circuit Services. Paul's experience and expertise make him an indispensable part of Epec's team. Paul holds a mechanical engineering degree from Seneca College.

Recent Posts


What is a Flexible Circuit Coverlay?

Written by Paul Tome
Posted on March 14, 2014 at 2:45 PM

In the flexible printed circuit board manufacturing process, a flex circuit coverlay (aka coverfilm) is used to encapsulate and protect the external circuitry of a flexible circuit board.

A flexible circuit coverlay serves the exact same function as solder mask that is used on a rigid printed circuit board. The difference with a flex coverlay is the needed element of flexibility and durability it provides to the flex PCB design.

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Why You Should Use Flex Circuits in Your Application

Written by Paul Tome
Posted on August 13, 2013 at 2:35 PM

Considering using a flexible printed circuit board (flex PCB) in your next project? Flex circuits offer several advantages, whether you plan to use them in a future project or for revamping your existing designs. Here we detail some of the most impactful advantages of flex PCB, including packaging, reliability, capabilities, and cost savings.

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