--- title: "Flex and Rigid-Flex PCBs: A Design and Layout Point of View" description: Learn flex and rigid-flex PCB design best practices for bend radii, stack-ups, trace routing, stiffeners, and fabrication-ready data. image: https://blog.epectec.com/hubfs/flexible-circuit-designed-with-staggered-traces.jpg --- [![Epec Engineered Technologies](https://www.epectec.com/images/logo.png "Epec Engineered Technologies")](https://www.epectec.com/) [![Epec Engineered Technologies](https://www.epectec.com/images/logo.png "Epec Engineered Technologies")](https://www.epectec.com/) - [Articles](https://www.epectec.com/articles/) - [Blog](https://blog.epectec.com/) - [Webinars](https://www.epectec.com/webinar/) - [Videos](https://www.epectec.com/videos/) - [Case Studies](https://www.epectec.com/case-studies/) - [News & Events](https://www.epectec.com/news/) - [Customer Portal](https://system.netsuite.com/c.406760/site/NSlogin.html) - [About](https://www.epectec.com/about/overview/) - Back - [Company Overview](https://www.epectec.com/about/overview/) - 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[Tweet](https://twitter.com/share) [Flex and rigid-flex printed circuit boards](https://www.epectec.com/flex/) (PCBs) require design data that communicates both the electrical layout and the circuit’s physical behavior. Unlike a [rigid PCB](https://www.epectec.com/pcb/), a flexible circuit must fit into its intended space while accommodating bends, transitions, stiffeners, and other mechanical features. [![Free Download: Flex & Rigid-Flex PCB Array Panelization](https://no-cache.hubspot.com/cta/default/707152/80b3c2d7-9d0e-4426-b212-dcfb23818ad6.png)](https://cta-redirect.hubspot.com/cta/redirect/707152/80b3c2d7-9d0e-4426-b212-dcfb23818ad6) A complete manufacturing data set should clearly define the circuit’s outlines, stack-up requirements, bend areas, hole locations, protective coatings, and material constraints. Addressing these details during design can reduce revisions and manufacturing delays. ## Flex and Rigid-Flex PCB Terminology Several [terms describe](https://www.epectec.com/flex/glossary/) the construction and mechanical features of flex and rigid-flex PCBs. ### FPCB A flex printed circuit board, or FPCB, is designed to bend, flex, or twist so that it can fit within the final product. ### RFPCB A rigid-flex printed circuit board, or RFPCB, combines one or more flexible sections with multiple rigid areas. The flexible sections connect the rigid portions and allow the circuit to conform to the product’s physical configuration. ### Loose Leaf A loose-leaf construction includes multiple flex layers or areas that are not bonded together within the flexible portion. ### Anchors or Tiedowns Anchors or tiedowns are plated through holes located within a flex area, typically near a mounting location. These features may use teardrops to provide additional stability. ### Teardrops Teardrops are built-up copper areas at the transition between a circuit trace and a pad. The added copper creates a teardrop shape at the interface. ### Stiffeners [Stiffeners](https://www.epectec.com/flex/flex-circuit-stiffeners.html) are commonly made from polyimide or FR4 and added to selected flex areas. They strengthen or support the circuit where additional rigidity is needed for assembly or installation. ### Cross-Hatching Cross-hatching creates a non-solid ground area. In a bend area, a solid ground plane can restrict the circuit’s ability to flex, while a cross-hatched pattern can retain greater flexibility. ### PSA PSA is a [pressure-sensitive adhesive](https://blog.epectec.com/flexible-circuit-board-designs-with-pressure-sensitive-adhesives) applied to a flex or rigid-flex PCB so that it can be attached to the final product. ### Transition Zone The transition zone is the area where rigid and flexible materials meet or where a flex section exits the center of a rigid material stack. ## What a Flex or Rigid-Flex Data Set Must Define Flex and rigid-flex data sets require additional mechanical information beyond electrical circuitry. The fabricator needs to understand the part’s final shape, where it fits within the product, and how its dimensions change when the circuit is bent or flexed into position. **Relevant dimensional information includes:** - Part length - Part width - Finished thickness - Final installed shape - Location of each bend or flex area - Overall circuit outline - Individual flex-section outlines - Stiffener outlines A flex or rigid-flex PCB may contain several outlines rather than one overall board profile. Each outline should be identified accurately so that the fabricator can distinguish between the complete part, individual flexible sections, and stiffeners. ![Example of a rigid-flex circuit board outline](https://blog.epectec.com/hs-fs/hubfs/blog/rigid-flex-circuit-board-outline.jpg?width=800&name=rigid-flex-circuit-board-outline.jpg) *Example of a rigid-flex circuit board outline.* Incomplete or unclear data can create uncertainty during engineering and production. Clearly labeled outlines allow the fabricator to interpret the intended construction before tooling and manufacturing begin. ## Coordinate Stack-Up Requirements with the Fabricator The [stack-up](https://www.epectec.com/webinar/08-15-2024/defining-stack-ups-for-flex-and-rigid-flex-circuit-boards.html) determines how the circuit’s conductive and insulating layers are arranged. For flex and rigid-flex constructions, it also influences overall thickness, balance, and how the flexible section exits the rigid area. When the application does not require a particular construction, the fabricator can determine an appropriate stack-up based on the product requirements and available materials. Any condition that requires a non-balanced construction should be communicated during the design stage. A balanced construction is preferred in both rigid and flexible circuit boards. In a rigid-flex PCB, the flex section should exit near the center of the balanced rigid-layer construction. [Material availability](https://blog.epectec.com/how-flexible-pcb-material-selection-affects-lead-times) should also be considered. When a specific material is not critical to the design, allowing the supplier to select an available material can reduce unnecessary sourcing and manufacturing constraints. However, any required material should be identified clearly in the data set. ## Account for the Finished Flex Thickness and Bend Radius The [bend area](https://blog.epectec.com/flex-rigid-flex-bend-capabilities) should be laid out to avoid concentrated mechanical stress. Right-angle trace routing should not be used where the circuit bends. Instead, traces should follow a smooth, curved radius through the bend area. Sharp trace corners can create points where the circuitry is more likely to break during bending. Smooth curves distribute the change in direction across a larger area and better support the intended flexing action. ![Flexible circuit showing bend radius trace angles](https://blog.epectec.com/hs-fs/hubfs/blog/flexible-circuit-showing-bend-radius-trace-angles.jpg?width=800&name=flexible-circuit-showing-bend-radius-trace-angles.jpg) *Flexible circuit showing bend radius trace angles.* The design data should identify the bend location and provide enough information to evaluate whether the planned radius is compatible with the flex construction. ## Stagger Traces Across Multiple Layers In a multi-layer flex construction, traces on adjacent layers should be staggered rather than routed directly over one another from side to side. Staggering prevents copper tracks from continuously stacking in the same locations. This helps maintain the thinness and flexibility of the circuit through the bend area. ![Flexible circuit designed with staggered traces](https://blog.epectec.com/hs-fs/hubfs/blog/flexible-circuit-designed-with-staggered-traces.jpg?width=800&name=flexible-circuit-designed-with-staggered-traces.jpg) *Flexible circuit designed with staggered traces.* Trace placement should therefore be evaluated across the complete multi-layer construction rather than one layer at a time. A routing pattern that appears acceptable on an individual layer may create a locally thicker or less flexible area when aligned with copper on adjacent layers. ## Limit Vias and Provide Sufficient Annular Rings Holes and vias add rigid features to a flexible circuit. The design should use as few holes as possible within flex areas, particularly where the circuit bends. - A 0.008" hole requires a 0.006" annular ring. - A 0.008" hole therefore requires a 0.020" copper pad to provide the stated annular ring. The flex process requires more annular ring than a rigid PCB process. Larger mounting holes used to attach the flexible circuit to the final product should also have a larger annular ring. Teardrops should be added where appropriate to increase the integrity of the connection between the pad and circuit trace. Hole size, pad diameter, annular ring, and trace entry should be treated as one connected design. The pad must provide enough copper around the finished hole while supporting the trace-to-pad interface. ## Keep Holes Away from the Transition Zone The transition between rigid and flexible materials requires careful feature placement. All holes should remain a minimum of 0.050" from the transition zone. ![Example of transition zone from the rigid to flex areas](https://blog.epectec.com/hs-fs/hubfs/blog/transition-zone-from-the-rigid-to-flex-areas.jpg?width=800&name=transition-zone-from-the-rigid-to-flex-areas.jpg) *Example of transition zone from the rigid to flex areas.* This spacing applies to the area where the flex section exits the rigid portion. Locating holes too close to this transition may place rigid features near an area that must accommodate differences in construction and movement. Hole locations should be checked against the transition-zone boundary before manufacturing data is released. The transition itself must also be defined clearly enough for the fabricator to apply the required spacing. ## Use Cross-Hatched Ground Areas Where the Circuit Bends Ground areas or polygons within a flexing region should use a cross-hatched pattern rather than a solid plane. A solid copper pour can restrict bending by creating a continuous rigid area. Cross-hatching removes portions of the copper while retaining the intended ground pattern, allowing the circuit to remain more flexible. The cross-hatched area must still be coordinated with the required electrical design. Avoid solid pours in bend areas, but this does not provide dimensions or electrical parameters for the cross-hatch pattern. ## Protect Flex and Rigid Areas with the Appropriate Coating Circuitry requires protection from environmental exposure, shorting, and physical damage. A rigid-flex PCB may use both liquid photoimageable mask and [coverlay](https://blog.epectec.com/what-is-a-flexible-circuit-coverlay), depending on the circuit area. ### Coverlay on Flexible Areas Coverlay is used over flexible areas because it can accommodate bending. It is routed to shape and placed on the circuit surface. Because coverlay openings are created and positioned differently from LPI openings, they must be larger. Areas containing mounting devices or components may require gang masking rather than individually defined openings. ### LPI on Rigid Areas LPI, or liquid photoimageable mask, provides tighter opening control than coverlay. It is typically associated with the rigid areas of a rigid-flex PCB construction. Both LPI and coverlay protect the underlying copper, but their different processing and mechanical characteristics affect where each is used. Pad openings and circuit-to-pad spacing should follow the applicable design rules. The data set must distinguish the areas that receive coverlay from those that receive LPI. ### Identify Stiffeners and Attachment Features Stiffeners provide localized reinforcement where a flex circuit requires added support. Such areas may include component locations, mounting interfaces, connectors, or other points involved in assembly. The data set should define each stiffener outline and identify its required material when that material is critical. Polyimide and FR4 are [typical stiffener materials](https://blog.epectec.com/various-stiffener-materials-for-flexible-circuit-boards). If PSA is needed to bond the circuit to the final product, its location must also be defined. The PSA area should be treated as part of the physical construction because it affects how the flex or rigid-flex PCB is installed. These features should not be communicated only through general notes. Their locations and outlines need to correspond with the circuit geometry. ### Use DFM to Review the Complete Data Set A [design for manufacturing review](https://www.epectec.com/engineering/free-dfm.html) can identify issues in the data set before the circuit enters production. The review should consider both electrical layout and mechanical construction. **Relevant review items include:** - Overall, flex, and stiffener outlines - Stack-up balance - Flex exit location - Material requirements - Flex thickness and bend radius - Trace routing through bend areas - Alignment of traces on adjacent layers - Hole and via placement - Annular-ring dimensions - Distance between holes and transition zones - Ground-plane construction - Coverlay and LPI areas - Pad openings and spacing - Stiffener and PSA locations Finding conflicts during the design and layout stage can reduce the need for later revisions. DFM is especially important for flex and rigid-flex PCBs because the electrical data, material stack-up, and intended mechanical movement must function together. ### Involve the PCB Fabricator During Design Fabricator involvement is most useful before the data set and stack-up become fixed. Early review allows the proposed construction to be evaluated against material availability and manufacturing requirements. If manufacturing constraints are not considered during development, conflicts may not appear until prototyping. Resolving them at that point may require a data-set revision or another prototype cycle. The fabricator can review the proposed outlines, stack-up, transition zones, bend areas, holes, coatings, and materials while design changes are still practical. This coordination helps align the layout with an achievable flex or rigid-flex construction. ## Balancing Space, Flexibility, and Manufacturability Flex and rigid-flex PCBs can help reduce the space occupied by conventional interconnections and support products that require defined bends or multiple rigid sections. Achieving those benefits depends on treating the circuit as both an [electrical design and a mechanical structure](https://blog.epectec.com/electrical-and-mechanical-requirements-in-flexible-circuit-designs). **The design must coordinate:** - The final installed shape - Available product space - Flex and rigid-area outlines - Finished flex thickness - Required bend radius - Trace geometry through bend areas - Via and mounting-hole locations - Transition-zone clearances - Ground-plane flexibility - Coverlay and LPI requirements - Stiffener and PSA locations - Stack-up balance and material availability Clear fabrication data and early DFM review allow these requirements to be evaluated before production. The resulting data set should describe not only what circuitry is required, but also how the completed flex or rigid-flex PCB must fit, bend, and interface with the final product. ## Summary Successful flex and rigid-flex PCB manufacturing begins with a data set that defines the complete physical construction. Overall outlines, flex outlines, stiffener boundaries, stack-up requirements, bend areas, and transition zones must be identified clearly. Layout decisions directly affect flexibility. Traces should use smooth curves through bend areas, copper tracks should be staggered between layers, holes should be limited, and solid ground pours should be replaced with cross-hatched patterns where bending is required. Maintain a 0.050" minimum distance between holes and the transition zone, and a 0.006" annular ring for the described via and mounting-hole examples. Coverlay protects flexible areas, while LPI provides tighter control in rigid areas. Stiffeners, PSA, pad openings, and other mechanical features must also be included in the manufacturing data. Early coordination with the PCB fabricator and a complete DFM review can identify conflicts among layout, materials, flexibility, and manufacturing before the design proceeds to production. --- ## Key Takeaways - **Precise outlines are critical:** Multiple outlines (overall, flex portion, stiffeners) must be accurately defined for proper fabrication and labeling. - **Balanced stack-ups improve reliability:** Letting the fabricator determine the best stack-up helps avoid unbalanced constructions and ensures better performance. - **Layout directly affects flexibility:** Use smooth curved traces, staggered copper layers, and avoid vias near transition zones to maintain bend reliability. - **Protective coatings matter:** Flex areas require coverlay while rigid areas use LPI mask, both essential to protect copper and ensure durability. - **Early collaboration saves time and cost:** Involving the PCB fabricator early in design with DFM checks reduces errors, re-spins, and delays to market. - [Tweet](https://twitter.com/share) Topics: [Flex & Rigid-Flex PCB's](https://blog.epectec.com/topic/flex-rigid-flex-pcbs), [Product Design](https://blog.epectec.com/topic/product-design) --- [Next](https://blog.epectec.com/human-machine-interface-design-options-to-meet-mil-std-requirements) | [All posts](https://blog.epectec.com/all) | [Previous](https://blog.epectec.com/emi-shielding-methods-for-flex-and-rigid-flex-pcb-designs-q-and-a) [![New Call-to-action](https://no-cache.hubspot.com/cta/default/707152/4d156df3-b2aa-49a2-b653-d71d26845ec3.png)](https://cta-redirect.hubspot.com/cta/redirect/707152/4d156df3-b2aa-49a2-b653-d71d26845ec3) ## Leave a Comment --- ## Related Posts --- ### Recent Posts --- ### Posts by Topic - [Printed Circuit Boards (162)](https://blog.epectec.com/topic/printed-circuit-boards) - [Product Design (138)](https://blog.epectec.com/topic/product-design) - [Battery Packs (122)](https://blog.epectec.com/topic/battery-packs) - [Cable Assemblies (102)](https://blog.epectec.com/topic/cable-assemblies) - [Flex & Rigid-Flex PCB's (95)](https://blog.epectec.com/topic/flex-rigid-flex-pcbs) - [Electronics Industry (61)](https://blog.epectec.com/topic/electronics-industry) - [User Interfaces (55)](https://blog.epectec.com/topic/user-interfaces) - [Quality Solutions (33)](https://blog.epectec.com/topic/quality-solutions) - [Flexible Heaters (30)](https://blog.epectec.com/topic/flexible-heaters) - [Events, Training, and Support (9)](https://blog.epectec.com/topic/events-training-and-support) - [RF Products (7)](https://blog.epectec.com/topic/rf-products) - [CNC Machining (3)](https://blog.epectec.com/topic/cnc-machining) - [Fans & Motors (1)](https://blog.epectec.com/topic/fans-motors) See All --- --- ### Need Help with A Project? 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