Epec's Blog | Electronics Manufacturing Solutions

In today’s increasingly connected world, high-speed digital signaling is no longer limited to specialized applications; it’s now a requirement across a broad spectrum of industries, including aerospace, medical, automotive, and advanced communications.

Prototyping your new rigid-flex PCB design is critical. It’s best to test your design, ensure everything fits, and look for obvious issues before jumping into full-scale production. As necessary as this step is, it also comes with a cost that can be tough to justify to stakeholders and decision-makers.

In a flex or rigid-flex PCB construction, many elements have to be considered that can be seen as important to the overall design such as copper weight, layer count, and many other things. However, among all the portions of a design, the one that usually gets forgotten is what bonds and holds it all together, the adhesives and pre-pregs that serve to bond the stack-up.

At the conclusion of our webinar, Designing Flex and Rigid-Flex PCBs to Prevent Failure, we had several questions submitted to our presenter, Zachary Walker, Product Manager of Flex and Rigid-Flex Circuits at Epec. We have compiled these questions into a readable format on our blog.

Optimizing performance is something that can be found in every aspect of life. From cars to computers, and from tools to PCBs, optimizing performance can lead to better reliability, less risk, and ultimately a more robust product.

When it comes to printed circuit boards, rigid-flex PCBs can be one of the most complicated. Many describe rigid-flex as being more akin to two boards in one, both in processes and materials. This can make for a difficult time in designing the board, setting standards, and even selecting materials.

Creating a high-performance flexible printed circuit board is contingent upon having the right copper weight. With high-temperature, high-power, and long-lasting applications, the weight of the copper used becomes even more important.

The manufacturing of printed circuit boards (PCBs), especially flex and rigid-flex PCBs, involves intricate processes that require precision and expertise. Among the critical aspects of PCB manufacturing are surface finishing and stiffener bonding, both of which significantly impact the reliability and performance of the final product.

At the conclusion of our webinar, Defining Stack-Ups for Flex and Rigid-Flex Circuit Boards, we had several questions submitted to our presenter, Zachary Walker, Product Manager of Flex and Rigid-Flex Circuits at Epec. We have compiled these questions into a readable format on our blog.

In the realm of electronics design, especially when dealing with Gerber files for flexible circuit board layouts, engineers continually seek innovative solutions to combat electromagnetic interference (EMI). Shielding is a pivotal strategy in this battle, serving not just to protect sensitive components but also to ensure the integrity and performance of the electronic device as a whole.