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Chris Perry - Printed Circuit Board Supply Chain Manager

Chris Perry - Printed Circuit Board Supply Chain Manager
Chris has been with Epec for almost two decades, including 8 years manufacturing experience within a quality control role and 2 years in the front end planning department. As a lab technician, Chris analyzed and maintained chemical processes within bare board manufacturing, while aiding with overall quality in all departments. He also monitored and maintained the company wastewater facility to comply with local environmental agencies. As Epec has grown, Chris has continued to accept new responsibilities within the company. Chris has also held the role of PCB planning, where he learned the entire process, through customer delivery. Chris has been certified through Addstan Management Systems as an ISO 9001:2000 Internal Auditor, and most recently received IPC-A-600 Certified IPC Specialist from Eptac Corporation. Chris received his A.S. degree in Environmental Science at Bristol College, was certified as Class III Industrial Wastewater operator, and also was certified as an emergency response operator.

Recent Posts


Urban Legends of PCB Processes: ENIG Black Pad

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on January 19, 2018 at 2:37 PM

I can remember the first ‘incident’ of black pad, years ago, when Epec started to use the electroless nickel immersion gold (ENIG) process. We didn’t notice the issue at the time, as it is not evident on the bare board, but received the complaint from assembly as it was later identified on completed assemblies.

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The PCB Jump Scoring Process

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on October 12, 2017 at 3:36 PM

The V-score process is the addition of thin, double-sided cuts into printed circuit board (PCB) laminate for the purpose of assisting in the removal of individual parts from the array. The thin cuts which do not go all the way through the material, act as a perforation of the laminate so simple flexing of the laminate, or use of a cutting wheel, will aid in the removal of parts after the assembly process.

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Poor PCB Silkscreen Legibility Issues

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on July 27, 2017 at 9:00 AM

Among the multiple layers of a printed circuit board (PCB) lies the PCB silkscreen layer. The placement of the silkscreen markings, whether on the top or bottom layer, in conjunction with the features of the other layers, could affect the final legibility of the printed circuit board markings.

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Understanding An IPC 4101 Slash Sheet

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on January 31, 2017 at 11:53 AM

IPC 4101 (Specification for Base Materials for Rigid and Multi-Layer Printed Circuit Boards) was released for publication in December, 1997. It was released as the replacement standard for MIL-S-13949. However, it contained a majority of the exact wording from the military standard. It maintained the “slash sheet” format appendix to the standard that specifies the resin and fiber system of different PCB laminates, along with testing parameters and properties. Initially there were 41 slash sheets, but as the industry opens up to “Lead Free” and “Green” processes, the slash sheets have increased to 66, the current revision.

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RoHS Compliance Standards Beyond High Tg PCB

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on December 27, 2016 at 2:02 PM

As a contract manufacturer, say you receive a new circuit board part to assemble that is 6-layers with a high micro-via count, has blind and buried vias, and a lead free HASL finish. The circuit board laminate requirement for meeting the Restriction of Hazardous Substances, or RoHS compliance, is strictly Glass Transition Temperature(Tg) 170.

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Understanding Bow and Twist of Printed Circuit Boards

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on December 15, 2016 at 10:20 AM

Bow and twist of printed circuit boards (PCB) routinely rank among the highest levels of falsely identified non-conformance because it is perhaps the least understood. Envisioning a perfectly flat rigid circuit board as the standard is a fallacy believed by many incoming inspectors. Understanding the reasons and causes for PCB bow and twist can help resolve the issue at the board design stage.

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Incoming Inspection of Printed Circuit Boards

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on June 30, 2016 at 1:30 PM

As printed circuit board (PCB) designs get more demanding with advances in technology involving complex footprints and added costs to components, incoming inspection of printed circuit boards must take higher priority.

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Managing Quality with Asian PCB Manufacturers

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on January 28, 2016 at 1:30 PM

There was a time when “Made in China” was synonymous with cheaper, poor quality products. "Buyer beware" was the common theme associated with outsourcing to any Asian PCB manufacturers. So how did Epec approach this challenge and succeed? It was by managing quality through intense auditing, training, and qualification. Epec understood at a very early stage that first-class quality products from Asian manufacturers would require consistent presence, training, and auditing.

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PCB Cleanliness Attention to Details

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on October 13, 2015 at 3:13 PM

Cleanliness of bare circuit boards increases in importance with advances in PCB technology that continue to decrease conductor spacing. Inorganic contamination within printed circuit board fabrication can lead to electrochemical migration. Electrochemical migration is the dissolution and movement of metal ions in presence of electric potential, which results in the growth of dendritic structures between anode and cathode. These dendritic growths, which were minimal over periods of time, were not a concern of "yesterdays" bare boards.

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Matte Finish vs Gloss Finish In PCB Solder Mask Design

Written by Chris Perry - Printed Circuit Board Supply Chain Manager
Posted on March 27, 2015 at 9:47 AM

When creating your optimal circuit board design, one factor that must be considered is the solder mask and whether to go with matte finish solder mask or gloss finish mask for your final product. Usually, most designers don't specify their preference and end up leaving the decision to the PCB fabricator. Most fabricators will likely default to a gloss surface finish, the more popular choice of the two.

 

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