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Paul Tome - Product Manager Flex & Rigid Flex

Paul Tome - Product Manager Flex & Rigid Flex
As Product Manager of Flex & Rigid-Flex Circuits, Paul oversees our entire flex & rigid-flex product line. Though Paul's main responsibility is customer technical support, he is involved in each project from the beginning conceptual stages to delivery. He works directly with customers on their specific design requirements and makes sure that each product is designed correctly, troubleshooting any issues that may arise in the process. Paul came to Epec with 24 years of a great variety of experience in the electronics industry. He has been involved in all aspects of the industry including sales, engineering, and manufacturing. He has worked with PCBs and equipment manufacturing and has also been the owner of an engineering service and trust bureau. Previously, he was president at Advanced Circuit Services. Paul's experience and expertise make him an indispensable part of Epec's team. Paul holds a mechanical engineering degree from Seneca College.

Recent Posts


What It Takes to Manufacture Flexible PCBs

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on June 22, 2017 at 12:15 PM

To manufacture flexible PCBs there are some key areas you should be aware of. While flex circuits have some similar characteristics to rigid printed circuit boards, they require very different approaches in the manufacturing process.

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The Purpose of a Flex Circuit Stiffener

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on June 7, 2017 at 9:05 AM

In the world of flexible circuit boards, stiffeners are a common requirement in a lot of flex designs. By definition, stiffeners provide a mechanical support function and are not part of the electrical schematic of a design.

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IPC Design Standard Violations in Rigid-Flex PCBs

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on May 25, 2017 at 10:50 AM

It is critical for any flex circuit design to be free of errors and violations in order to get the application to market as fast as possible without unnecessary delay. To help designers avoid common design violations in rigid-flex PCBs, this blog post will discuss three of the most common Industry Association for Printed Circuit Board and Electronics Manufacturing (IPC) design violations.

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Why Flex and Rigid-Flex Tooling Costs More than Rigid PCBs

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on May 17, 2017 at 9:32 AM

One question we get asked frequently is: why flex and rigid-flex tooling costs more than rigid PCBs? The answer is quite simple; flex circuit tooling is a much more complex process than standard printed circuit boards.

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Flex Circuit Polyimide Coverlay & Soldermask Considerations

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on November 2, 2016 at 3:34 PM

The two primary options for encapsulating the external circuit layers of a flex circuit are Polyimide Coverlay and Flexible Liquid Photoimageable (LPI) Soldermask. The two materials however have very different capabilities and requirements.

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Rigid-Flex PCB Gerber Layout Requirements

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on August 16, 2016 at 4:07 PM

Rigid-flex printed circuit boards are unique with their integrated construction of both rigid PCB and flex circuit technologies. Being unique comes with a number of unique requirements that should be reviewed and implemented during the rigid-flex PCB Gerber layout phase of the design process.

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Common Flex & Rigid-Flex PCB Constructions

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on May 27, 2016 at 10:30 AM

Flex and rigid-flex PCB constructions have many variations that allow for a wide range of applications and solutions. A significant difference to rigid PCB constructions is that uneven layer counts are allowed and frequently used. The primary reasons being reduced flex thickness, improved flexibility and reduced part cost.

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Flex & Rigid-Flex Bend Capabilities

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on February 26, 2016 at 12:12 PM

An essential element of a flex or rigid-flex printed circuit board (PCB) design is verification that the construction will meet your mechanical bend requirements. Exceeding the minimum flex bend radius requirements creates the opportunity to exceed the physical properties of the copper circuitry resulting in failed parts and long term reliability concerns.

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Flex & Rigid-Flex PCB Concept & Mechanical Designs

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on November 18, 2015 at 2:30 PM

This blog post is intended to enforce the design support we offer at Epec in regards to our flex and rigid-flex PCB's. Technical design and engineering is one of our core fundamentals that allows us to help our customers meet there product requirements. The blog post will cover design areas that require special consideration.

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Adhesive & Adhesive-Less Polyimide Flex Core Material Types

Written by Paul Tome - Product Manager Flex & Rigid Flex
Posted on March 6, 2015 at 1:27 PM

Two distinct types of polyimide flex core material constructions are utilized in today’s flex circuit manufacturing. The difference is in the method used to physically attach the copper layers to the polyimide core. This results in a different set of material properties for each of the material types which must be factored in to a specific application to ensure the design meets all the requirements and is cost effective.

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