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Al Wright - PCB Field Applications Engineer

Al Wright - PCB Field Applications Engineer
Al has been in the industry for over 35 years and has been with Epec for more than15 years. As field application engineer, he handles a wide range of responsibilities including reviewing PCB designs for manufacturability during the quoting and design stage, interacting with off-site manufacturing facilities to solve technical issues during production, and programming CNC machines for in-house projects, reworks, and modifications. Al’s technical expertise is essential to Epec’s engineering department and provides valuable insight when working with customers. Previous to working at Epec, Al spent 20 years with CPC Incorporated, a medium-sized PCB manufacturer, learning hands-on about PCB processing before moving into front end engineering. Al brings impressive expertise to Epec and has worked with over 50,000 different PCB designs from his start in 1981 to the present day. He works with Epec’s team to get all designs right ahead of time so that products will be correct the first time.

Recent Posts


Heavy Copper Circuit Board Strength & Survivability

Written by Al Wright - PCB Field Applications Engineer
Posted on December 31, 2013 at 1:40 PM

The amount of heavy copper applied to the plated through-holes (PTH) plays a critical factor of the overall reliability of the printed circuit board. There are two key elements to consider. The first is the current capacity of the barrel for acceptable heat rise. The second is the mechanical strength determined by the copper thickness, hole-size and whether or not there are any support vias.

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Common PCB Fabrication Problems: Plating Voids

Written by Al Wright - PCB Field Applications Engineer
Posted on July 30, 2013 at 3:35 PM

Plated through holes are holes in a printed circuit board (PCB) with copper coated walls. These holes allow electricity to be carried from one side of the circuit board through the copper in the hole to the other side of the board. On any printed circuit board of two or more circuitry layers, plated through holes form the electrical interconnection between the different layers.

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